Patents by Inventor Mari Matsuyoshi

Mari Matsuyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and optical transmission module
    Patent number: 6635971
    Abstract: An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: October 21, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Toyoki Asada, Yuji Fujita, Hideo Sotokawa, Kazumi Kawamoto, Kunio Matsumoto, Shinya Hamagishi, Mari Matsuyoshi
  • Packaging structure and method of packaging electronic parts
    Patent number: 6589802
    Abstract: The present invention a structure in which a semiconductor integrated circuit chip can be easily removed and the reliability of flip-chip bonding is assured, a method of packaging electronic parts, and method and apparatus for detaching electronic parts. According to the invention, the object is achieved by a flip-chip bonding structure using two kinds of soluble and insoluble resins for bonding a semiconductor integrated circuit chip and a circuit board.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: July 8, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Toyoki Asada, Yuji Fujita, Kie Ueda, Naoya Kanda, Mari Matsuyoshi
  • Electronic device and optical transmission module
    Publication number: 20020090162
    Abstract: An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.
    Type: Application
    Filed: January 11, 2002
    Publication date: July 11, 2002
    Inventors: Toyoki Asada, Yuji Fujita, Hideo Sotokawa, Kazumi Kawamoto, Kunio Matsumoto, Shinya Hamagishi, Mari Matsuyoshi