Patents by Inventor Mari Uno

Mari Uno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210024699
    Abstract: A polyamic acid that is a polyaddition reaction product of a diamine and a tetracarboxylic dianhydrides, according to one or more embodiments of the present invention. The polyamic acid contains 2?-bistrifluoromethylbenzidine as a diamine component in addition to 3,3?,4,4?-biphenyltetracarboxylic dianhydride and 9,9?-(3,4?-dicarboxyphenyl)fluorenic dianhydride as tetracarboxylic dianhydride components. The polyamic acid may include 9,9?-(3,4?-dicarboxyphenyl)fluorenic dianhydride in an amount ranging from 0.5 mol % or more to 10 mol % or less based on total amount of the tetracarboxylic anhydride.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 28, 2021
    Applicant: KANEKA CORPORATION
    Inventor: Mari Uno
  • Publication number: 20210009760
    Abstract: A polyamic acid according to one or more embodiments of the present invention contains a structural unit represented by general formula (1) and a structural unit represented by general formula (2). In general formula (1), the plurality of R1s are each independently a hydrogen atom, a monovalent aliphatic group or an aromatic group. In general formula (2), the plurality of R2s are each independently an alkyl group having 1-3 carbon atoms or an aryl group having 6-10 carbon atoms. In general formulas (1) and (2), X is a tetravalent organic group. In general formula (2), the plurality of Ys are each independently an alkylene group having 1-3 carbon atoms or an arylene group having 6-10 carbon atoms, and m is an integer of 51-199.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: KANEKA CORPORATION
    Inventors: Hirofumi Nakayama, Mari Uno
  • Publication number: 20200102423
    Abstract: A polyamic acid that has a fluorine atom content of 25 wt % or less and an amount of a fluorine-containing diamine in the polyamic acid is 70 mol % or more with respect to 100 mol % of a sum of diamine components. The total number of moles of tetracarboxylic acid component in the polyamic acid is 0.960 times or more and less than 1.000 time total number of moles of diamine component. The polyamic acid preferably has the structural unit represented by formula (1) and the structural unit represented by formula (2). The polyamic acid may contain trans-1,4-cyclohexanediamine as the diamine component.
    Type: Application
    Filed: May 2, 2018
    Publication date: April 2, 2020
    Applicant: KANEKA CORPORATION
    Inventors: Hirofumi NAKAYAMA, Mari UNO
  • Publication number: 20190241705
    Abstract: A polyamide acid of the present invention contains, as a diamine component, 2,2-bistrifluoromethylbenzidine and trans-1,4-cyclohexanediamine, and contains, as a tetracarboxylic acid dianhydride component, a pyromellitic acid anhydride and a 3,3,4,4-biphenyltetracarboxylic acid dianhydride. A ratio of the trans-1,4-cyclohexanediamine to a total amount of the diamine is preferably 0.5-40 mol %. A polyimide is obtained by dehydration ring closure of the polyamide acid.
    Type: Application
    Filed: July 31, 2017
    Publication date: August 8, 2019
    Applicant: KANEKA CORPORATION
    Inventor: Mari UNO
  • Patent number: 10155864
    Abstract: The present invention has an object to obtain a polyimide film that has a sufficiently smooth surface without peeling even in a case where the polyimide film is a thick film and that is excellent in adhesion to an inorganic substrate. An alkoxysilane-modified polyamic acid solution of the present invention contains: an alkoxysilane-modified polyamic acid; and a surface control agent, the alkoxysilane-modified polyamic acid solution having a specific viscosity, the alkoxysilane-modified polyamic acid being obtained by reacting a polyamic acid with an alkoxysilane compound containing an amino group, and the polyamic acid being obtained by reacting a diamine with a tetracarboxylic dianhydride.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: December 18, 2018
    Assignee: Kaneka Corporation
    Inventors: Mari Uno, Etsuo Horii
  • Publication number: 20180355172
    Abstract: Provided are a nanosilica-containing polyamide acid and a nanosilica-containing polyimide. The nanosilica-containing polyamide acid contains a polyamide acid, which is a polymer of an alicyclic tetracarboxylic acid dianhydride and an aromatic diamine containing a carboxyl group, and nanosilica, and is excellent in heat resistance, low thermal expansion and transparency, and exhibits low double refraction. Also provided is a product or a member that meets requirements of high heat resistance and high transparency by using the nanosilica-containing polyamide acid and the nanosilica-containing polyimide.
    Type: Application
    Filed: November 25, 2016
    Publication date: December 13, 2018
    Applicant: Kaneka Corporation
    Inventor: Mari UNO
  • Publication number: 20170190910
    Abstract: The present invention has an object to obtain a polyimide film that has a sufficiently smooth surface without peeling even in a case where the polyimide film is a thick film and that is excellent in adhesion to an inorganic substrate. An alkoxysilane-modified polyamic acid solution of the present invention contains: an alkoxysilane-modified polyamic acid; and a surface control agent, the alkoxysilane-modified polyamic acid solution having a specific viscosity, the alkoxysilane-modified polyamic acid being obtained by reacting a polyamic acid with an alkoxysilane compound containing an amino group, and the polyamic acid being obtained by reacting a diamine with a tetracarboxylic dianhydride.
    Type: Application
    Filed: May 18, 2015
    Publication date: July 6, 2017
    Applicant: Kaneka Corporation
    Inventors: Mari Uno, Etsuo Horii