Abstract: A method of bonding a substrate is described comprising providing a fluoropolymer film comprising: i) a first fluoropolymer comprising at least 80, 85, or 90 wt. % of polymerized perfluorinated monomers; ii) optionally a second fluoropolymer having a greater amount of polymerized tetrafluoroethylene than the first fluoropolymer; wherein the first fluoropolymer and/or second fluoropolymer when present comprises halogen cure sites; and iii) one or more compounds comprising an electron donor group and one or more ethylenically unsaturated groups; applying the fluoropolymer film to a substrate; and heating the fluoropolymer film to a temperature of at least 150, 160, 170, 180, 190 or 200° C.

Abstract: Electronic telecommunication articles are described comprising a layer of fluoropolymer composition comprising: an amorphous fluoropolymer comprising at least 80, 85, or 90% by weight of polymerized units perfluorinated monomers including one or more unsaturated perfluorinated alkyl ethers; and crystalline fluoropolymer; wherein the fluoropolymer composition lacks crosslinks of a chemical curing agent. Also described are methods of making a coated substrate, substrates comprising a fluoropolymer composition, and fluoropolymer compositions.

Abstract: Electronic telecommunication articles are described comprising a crosslinked fluoropolymer layer comprising fluoropolymer particles having a particle size of greater than 1 micron. In typical embodiments, the crosslinked fluoropolymer layer is a in substrate, patterned (e.g. photoresist) layer, insulating layer, passivation layer, cladding, protective layer, or a combination thereof. Also describes are methods of making an electronic telecommunications article and method of forming a patterned fluoropolymer layer. The fluoropolymer preferably comprises at least 80, 85, or 90% by weight of polymerized units of perfluorinated monomers and cure sites selected from nitrile, iodine, bromine, and chlorine. Illustrative electronic communication articles include integrated circuits, printed circuit boards, antennas, and optical fiber cables. Fluoropolymer compositions are also described.