Abstract: A subsea variable speed drive apparatus comprising a pressure resistant container (90) comprising a curved wall section having a curved, internal surface (90a); and a variable speed drive comprising at least one power electronics module (50) arranged inside the container and held at a predetermined ambient pressure. The at least one power electronics module is mounted on a heatsink (40) which is mounted on the internal surface, the heatsink comprising a curved surface (40b) contacting the internal surface and having a radius of curvature corresponding to the radius of curvature of the internal surface. A subsea hydrocarbon fluid pumping system comprising such subsea variable speed drive apparatuses and a related method are also disclosed.

Abstract: Embodiments of the invention relate to a method for creating a flexible circuit, including defining a cavity in a top surface of a substrate before disposing a semiconductor chip within the cavity, such that a backside of the chip is disposed beneath the top surface of the substrate and above a bottom surface of the cavity. The method also includes forming a flexible connecting layer on the top surface of the substrate and extending over the chip. Other embodiments relate to a flexible circuit including a substrate defining a cavity in a top surface thereof. The cavity has encapsulant and a chip disposed therein, wherein a frontside of the chip is substantially coplanar with the top surface of the substrate. A flexible connecting layer is disposed on the top surface of the substrate and is partially supported by the substrate.