Patents by Inventor Maria Cristina Barbosa DeJesus

Maria Cristina Barbosa DeJesus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot melt adhesives and uses thereof
    Patent number: 11970635
    Abstract: The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functionalized wax, functionalized olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in disposable articles such as diapers, adult incontinence articles, underpads, personal care garments, and the like.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 30, 2024
    Assignee: HENKEL AG & CO. KGaA
    Inventors: Maria Cristina Barbosa DeJesus, Charles W. Paul, Valerie Alexis, Geetanjaliben Shah
  • HOT MELT ADHESIVES AND USES THEREOF
    Publication number: 20230066070
    Abstract: The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functionalized wax, functionalized olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in disposable articles such as diapers, adult incontinence articles, underpads, personal care garments, and the like.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 2, 2023
    Inventors: Maria Cristina Barbosa DeJesus, Charles W. Paul, Valerie Alexis, Geetanjaliben Shah
  • Thermal Interface Materials Based on Two-Part Polyurethanes
    Publication number: 20210371620
    Abstract: Disclosed herein are thermal interface materials based on two-part polyurethane resins comprising a polyurethane resin and a thermally conductive filler dispersed throughout the polyurethane resin, wherein the polyurethane resin is formed from two parts comprising: a first part comprising a triol, and a second part comprising an isocyanate-functionalized component, wherein at least one of the first part and the second part comprises a thermally conductive filler material.
    Type: Application
    Filed: August 13, 2021
    Publication date: December 2, 2021
    Inventors: Stanley Shengqian Kong, Valerie Alexis, Maria Cristina Barbosa Dejesus, Claudia Meckel-Jonas, Elizabeth Jackson, Chunyong Wu
  • Low application temperature hot melt adhesive
    Patent number: 10138398
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: November 27, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20180148615
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 31, 2018
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 9914857
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: March 13, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • HOT MELT ADHESIVES AND USES THEREOF
    Publication number: 20180037777
    Abstract: The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functional wax, functional olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in disposable articles such as diapers, adult incontinence articles, underpads, personal care garments, and the like.
    Type: Application
    Filed: October 16, 2017
    Publication date: February 8, 2018
    Inventors: Maria Cristina Barbosa DeJesus, Charles W. Paul, Valerie Alexis, Geetanjaliben Shah
  • FOAMABLE HOT MELT GASKET SEALANTS AND USE THEREOF
    Publication number: 20170282494
    Abstract: The invention relates to a one-part, foamable hot melt gasket sealant. The foamable hot melt adhesive comprises greater than about 35 wt % of a rubber block copolymer, a tackifier and less than about 5 wt % of a wax. The foamable hot melt adhesive can be applied onto a space in between two mating surfaces without expensive foam-in-place equipment. The foamable hot melt gasket sealant is particularly suitable in automotive applications, electrical component and technical lighting sectors.
    Type: Application
    Filed: June 16, 2017
    Publication date: October 5, 2017
    Inventors: Valerie ALEXIS, Maria Cristina Barbosa DeJesus, Charles W. Paul, Drik Kasper, Marcus Heeman, Sebastian Kostyra
  • Molding and overmolding compositions for electronic devices
    Patent number: 9415532
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: August 16, 2016
    Assignee: HENKEL IP HOLDING GMBH
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • Adhesives made from polymer systems
    Patent number: 9290680
    Abstract: The present invention relates to an adhesive, comprising at least one polymer system obtained by a process for reducing the melt viscosity of at least one polymer blend starting material, wherein the process comprises the step of treating at least one polymer blend with at least one radical donor under shear stress at a temperature above the softening point of said polymer blend.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: March 22, 2016
    Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBH
    Inventors: Dirk Kasper, Thomas Mueller, Gunter Hoffmann, Knut Hoffmann, Andy Swain, Claudia Yaacoub, Maria Cristina Barbosa DeJesus
  • MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES
    Publication number: 20160031134
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 4, 2016
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20150322302
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: Yuhong HU, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Molding and overmolding compositions for electronic devices
    Patent number: 9127153
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 8, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 9115299
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: August 25, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa Dejesus
  • ADHESIVES MADE FROM POLYMER SYSTEMS
    Publication number: 20140371379
    Abstract: The present invention relates to an adhesive, comprising at least one polymer system obtained by a process for reducing the melt viscosity of at least one polymer blend starting material, wherein the process comprises the step of treating at least one polymer blend with at least one radical donor under shear stress at a temperature above the softening point of said polymer blend.
    Type: Application
    Filed: September 2, 2014
    Publication date: December 18, 2014
    Inventors: Dirk Kasper, Thomas Mueller, Gunter Hoffmann, Knut Hoffmann, Andy Swain, Claudia Yaacoub, Maria Cristina Barbosa DeJesus
  • Adhesives made from polymer systems
    Patent number: 8853329
    Abstract: The present invention relates to an adhesive, comprising at least one polymer system obtained by a process for reducing the melt viscosity of at least one polymer blend starting material, wherein the process comprises the step of treating at least one polymer blend with at least one radical donor under shear stress at a temperature above the softening point of said polymer blend.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: October 7, 2014
    Assignees: Henkel AG & Co. KGAA, Henkel US IP LLC
    Inventors: Dirk Kasper, Thomas Möller, Gunter Hoffmann, Knut Hoffmann, Andy Swain, Claudia Yaacoub, Maria Cristina Barbosa Dejesus
  • ELASTIC ATTACHMENT ADHESIVE AND USE THEREOF
    Publication number: 20140235127
    Abstract: The present invention relates to elastic attachment adhesives that comprise non-metallocene catalyzed polymers. The elastic attachment adhesives have stable creep performance under prolonged aging parameters, making these adhesives particularly well suited for elastic applications.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 21, 2014
    Applicant: Henkel Corporation
    Inventors: Maria Cristina Barbosa DeJesus, Charles Paul, Valerie Alexis
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20140171586
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: February 24, 2014
    Publication date: June 19, 2014
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa Dejesus
  • MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES
    Publication number: 20140127445
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 8, 2014
    Applicant: Henkel Corporation
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • Adhesives Made From Polymer Systems
    Publication number: 20120016086
    Abstract: The present invention relates to an adhesive, comprising at least one polymer system obtained by a process for reducing the melt viscosity of at least one polymer blend starting material, wherein the process comprises the step of treating at least one polymer blend with at least one radical donor under shear stress at a temperature above the softening point of said polymer blend.
    Type: Application
    Filed: September 26, 2011
    Publication date: January 19, 2012
    Inventors: Dirk Kasper, Thomas Möller, Gunter Hoffmann, Knut Hoffmann, Andy Swain, Claudia Yaacoub, Maria Cristina Barbosa Dejesus