Patents by Inventor Maria de la Piedad Fernandez-Martinez

Maria de la Piedad Fernandez-Martinez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for determining the relative positional accuracy of two structure elements on a wafer
    Patent number: 7186484
    Abstract: A measurement mark (3) for determining the relative positional accuracy of a progressive projection onto a wafer (5), the projection being performed with two masks (3, 4), comprising two structure elements (10, 20) formed on a respective one of the masks (1, 2). The structure elements (10, 20) overlap with regard to their position on the masks so that, during the projection of the second structure element (20), an electrically conductive structure (30) formed on the basis of the first structure element on the wafer (5) is overformed by removal of a portion (31). In an electrical line width measurement, the reduced width (CD, CD30a) of the structure (30) is measured and compared either with the original width (62) or with that width (CD30b) of a further partial element (30b) produced by the overforming.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: March 6, 2007
    Assignee: Infineon Technologies AG
    Inventors: Heiko Hommen, Jens Stäcker, Maria de la Piedad Fernandez-Martinez, Jens Uwe Bruch, Thorsten Schedel
  • Method for determining the relative positional accuracy of two structure elements on a wafer
    Publication number: 20050260510
    Abstract: A measurement mark (3) for determining the relative positional accuracy of a progressive projection onto a wafer (5), the projection being performed with two masks (3, 4), comprising two structure elements (10, 20) formed on a respective one of the masks (1, 2). The structure elements (10, 20) overlap with regard to their position on the masks so that, during the projection of the second structure element (20), an electrically conductive structure (30) formed on the basis of the first structure element on the wafer (5) is overformed by removal of a portion (31). In an electrical line width measurement, the reduced width (CD, CD30a) of the structure (30) is measured and compared either with the original width (62) or with that width (CD30b) of a further partial element (30b) produced by the overforming.
    Type: Application
    Filed: September 24, 2004
    Publication date: November 24, 2005
    Inventors: Heiko Hommen, Jens Stacker, Maria de la Piedad Fernandez-Martinez, Jens Bruch, Thorsten Schedel