Patents by Inventor Maria Dilay

Maria Dilay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coins coated with nickel, copper and nickel and process for making such coins
    Patent number: 5151167
    Abstract: This invention overcomes problems such as pinholes and blisters in making plated coin blanks and similar articles. A ferrous metal blank is electroplated with a strike of nickel, following which a coating of copper is applied at an initial low current density followed by full current density to minimize bridging. The low current density may be about 1/6 to 1/4 of the full current density. Preferably an outer layer of nickel is applied, also at an initial low current density, followed by full current density. Annealing before or after application of the final layer of nickel is advisable. This invention also relates to the resulting coin blank and coins.
    Type: Grant
    Filed: December 4, 1991
    Date of Patent: September 29, 1992
    Assignee: Royal Canadian Mint
    Inventors: Hieu C. Truong, Maria Dilay
  • Coins coated with nickel, copper and nickel
    Patent number: 5139886
    Abstract: This invention overcomes problems such as pinholes and blisters in making plated coin blanks and similar articles. A ferrous metal blank is electroplated with a strike of nickel, following which a coating of copper is applied at an initial low current density followed by full current density to minimize bridging. Preferably an outer layer of nickel is applied, also at an initial low current density, followed by full current density. Annealing before or after application of the final layer of nickel is advisable. This invention also relates to the resulting coin blank and coins.
    Type: Grant
    Filed: June 28, 1991
    Date of Patent: August 18, 1992
    Assignee: Royal Canadian Mint
    Inventors: Hieu Truong, Maria Dilay