Abstract: A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

Abstract: Apparatus and methods to metallize, reinforce, and hermetically seal multiple optical fibers are described herein. A ribbon of optical fibers may be placed into a fixture to expose a mid-span segment for removal of the coatings from the optical fibers by acid etching, laser, etc. A variety of metallic coatings may then be deposited onto the bare segment of the optical fibers. The metallized segment of optical fibers are then deposited with solderable alloy onto a plate for attachment to the plate for reinforcement of the metallized segment. The plate and metallized segment is then fed through a package opening and hermetically sealed to internally connect one or more components inside the package by heating the package to melt additional solder around the opening or gap. Epoxy is then applied over the solder to help protect the solder and additionally seal the package.

Abstract: A method of manufacturing a semiconductor device by attaching a flip chip die to an organic substrate using solder comprises applying no-clean flux to the flip chip die or the organic substrate; heating the flip chip die and the organic substrate to bond the flip chip die to the organic substrate, and cooling the flip chip die and the organic substrate. The step of heating the flux includes controlling oxygen and moisture content of an atmosphere surrounding the flux, preheating to a temperature of about 145° C. to about 165° C., soaking at a temperature of about 145° C. to about 165° C. for about four to about six minutes, and reflowing above the solder's melting point.

Abstract: A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.

Abstract: A method of manufacturing a flip-chip semiconductor device by attaching a semiconductor die to a substrate using solder comprises the steps of applying a no-clean flux to the semiconductor die and the substrate; heating the solder and the flux in a furnace to bond the semiconductor die to the substrate; and underfilling between the semiconductor die and the substrate. While the solder and flux is being heated, a reducing atmosphere in the furnace is being measured to determine the moisture content. When the moisture content exceeds a threshold amount, a signal will be provided. A reflow furnace for practicing the method is also disclosed.

Abstract: Apparatus and methods to metallize, reinforce, and hermetically seal multiple optical fibers are described herein. A ribbon of optical fibers may be placed into a fixture to expose a mid-span segment for removal of the coatings from the optical fibers by acid etching, laser, etc. A variety of metallic coatings may then be deposited onto the bare segment of the optical fibers. The metallized segment of optical fibers are then deposited with solderable alloy onto a plate for attachment to the plate for reinforcement of the metallized segment. The plate and metallized segment is then fed through a package opening and hermetically sealed to internally connect one or more components inside the package by heating the package to melt additional solder around the opening or gap. Epoxy is then applied over the solder to help protect the solder and additionally seal the package.

Abstract: A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

Abstract: An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.