Abstract: A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer.

Abstract: A method for manufacturing a semiconductor device includes providing a carrier and a semiconductor wafer having a first side and a second side opposite to the first side. The method includes applying a dielectric material to the carrier or the semiconductor wafer and bonding the semiconductor wafer to the carrier via the dielectric material. The method includes processing the semiconductor wafer and removing the carrier from the semiconductor wafer such that the dielectric material remains on the semiconductor wafer to provide a semiconductor device comprising the dielectric material.

Abstract: A method for manufacturing a semiconductor device includes providing a carrier and a semiconductor wafer having a first side and a second side opposite to the first side. The method includes applying a dielectric material to the carrier or the semiconductor wafer and bonding the semiconductor wafer to the carrier via the dielectric material. The method includes processing the semiconductor wafer and removing the carrier from the semiconductor wafer such that the dielectric material remains on the semiconductor wafer to provide a semiconductor device comprising the dielectric material.

Abstract: A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer.

Abstract: Apparatuses and methods are provided where porous metal is deposited on a substrate, a mask is provided on the porous metal and then an etching is performed.

Abstract: Apparatuses and methods are provided where porous metal is deposited on a substrate, a mask is provided on the porous metal and then an etching is performed.

Abstract: The invention relates to a fluorescent lamp, preferably a low pressure mercury discharge lamp for stimulating previtamin D3 production. The lamp has a discharge tube with a discharge gas filling. The inside wall of the discharge tube is covered with a phosphor coating for converting short wave UV radiation of the ionized discharge gas into longer wave UV radiation. The discharge tube is closed at both ends and provided with electrodes which are held and lead through a base cap at both ends. The base caps of the lamp are provided with contact pins for connecting the lamp to an electrical power supply. According to the improvement of the invention the UV light radiating coating of the discharge tube comprises a first phosphor for emitting light waves in the UVB spectrum and a second phosphor for emitting light waves in the visible light spectrum and for suppressing the emitted light in the UVB spectrum.

Abstract: An endoscopy illumination system with a light-emitting element placed at the tip of an endoscope is disclosed. Pulses of light illuminate moving parts of the human body, enabling an observer to obtain information about the dynamical behavior of intracorporal structures, including vocal fold oscillations. An electronic control unit, which may obtain frequency and phase information from a microphone detecting the sound of an examinee's voice, generates light pulses for stroboscopy. The light-emitting elements are over-modulated light emitting diodes in the preferred embodiment. The endoscopy illumination system may be powered by batteries, rechargeables, or transformers. When image capture devices, including CCD and CMOS cameras, are used to record video images, electronic gating circuits activate the light-emitting elements, resulting in improved imaging.