Abstract: Methods for growing single crystal silicon ingots that involve silicon feed tube inert gas control are disclosed. Ingot puller apparatus that include a flange that extends radially from a silicon funnel or from a silicon feed tube to reduce backflow of gases from the silicon feed tube into the growth chamber are also disclosed.

Abstract: Methods for growing single crystal silicon ingots that involve silicon feed tube inert gas control are disclosed. Ingot puller apparatus that include a flange that extends radially from a silicon funnel or from a silicon feed tube to reduce backflow of gases from the silicon feed tube into the growth chamber are also disclosed.

Abstract: Methods for growing single crystal silicon ingots that involve silicon feed tube inert gas control are disclosed. Ingot puller apparatus that include a flange that extends radially from a silicon funnel or from a silicon feed tube to reduce backflow of gases from the silicon feed tube into the growth chamber are also disclosed.

Abstract: Methods for preparing epitaxial wafers are disclosed. The methods may involve control of the (i) a growth velocity, v, and/or (ii) an axial temperature gradient, G, during the growth of an ingot segment such that v/G is less than a critical v/G. An epitaxial layer is deposited on a substrate sliced from the silicon ingot.

Abstract: Methods for preparing single crystal silicon substrates for epitaxial growth are disclosed. The methods may involve control of the (i) a growth velocity, v, and/or (ii) an axial temperature gradient, G, during the growth of an ingot segment such that v/G is less than a critical v/G and/or is less than a value of v/G that depends on the boron concentration of the ingot. Methods for preparing epitaxial wafers are also disclosed.

Abstract: Methods for preparing single crystal silicon substrates for epitaxial growth are disclosed. The methods may involve control of the (i) a growth velocity, v, and/or (ii) an axial temperature gradient, G, during the growth of an ingot segment such that v/G is less than a critical v/G and/or is less than a value of v/G that depends on the boron concentration of the ingot. Methods for preparing epitaxial wafers are also disclosed.

Abstract: Methods for preparing an ingot in an ingot puller apparatus are disclosed. Thermal simulations are performed with the length of the ingot puller apparatus side heater being varied in the thermal simulations. A side heater is selected based on the thermal simulations. An ingot puller apparatus having the selected side heater length is provided. A seed crystal is lowered into a melt within a crucible of the ingot puller apparatus and an ingot is withdrawn from the melt.

Abstract: Methods for producing single crystal silicon ingots in which the dopant concentration in the silicon melt is controlled are disclosed. The control of the dopant concentration enhances ingot quality by the reduction or elimination of dislocations in the neck, crown, and main body portions of the single crystal silicon ingot.

Abstract: Methods for producing single crystal silicon ingots in which the dopant concentration in the silicon melt is controlled are disclosed. The control of the dopant concentration enhances ingot quality by the reduction or elimination of dislocations in the neck, crown, and main body portions of the single crystal silicon ingot.

Abstract: A system for growing a crystal ingot from a melt includes a housing and a feed system. The housing defines a growth chamber and an ingot removal chamber positioned above the growth chamber. The feed system includes an enclosure, a feed material reservoir positioned within the enclosure, and a feed channel including an intake end and an outlet end. The intake end is configured to receive feed material from the feed material reservoir. The housing has an opening in communication with the removal chamber and a connector proximate the opening, and the enclosure has an opening and a connector configured to mate with the housing connector. The feed channel is moveable between a retracted position and an extended position in which the feed channel extends through the opening in the housing and the outlet end is positioned within the removal chamber.

Abstract: A method of loading a crucible includes loading a first layer of polysilicon chunks into the crucible and loading a second layer of granular polysilicon into the crucible to form a polysilicon charge such that the packing density of the polysilicon charge within the crucible is greater than 0.70.

Abstract: A method of loading a crucible includes loading a first layer of polysilicon chunks into the crucible and loading a second layer of granular polysilicon into the crucible to form a polysilicon charge such that the packing density of the polysilicon charge within the crucible is greater than 0.70.

Abstract: The present invention is a method for quantitatively measuring nitrogen in Czochralski silicon based on the detection of one or more N—O complexes by means of low temperature Fourier Transform infrared spectroscopy (LT-FTIR) in the far infrared spectral range (FIR).

Abstract: The present invention is a method for quantitatively measuring nitrogen in Czochralski silicon based on the detection of one or more N—O complexes by means of low temperature Fourier Transform infrared spectroscopy (LT-FTIR) in the far infrared spectral range (FIR).