Patents by Inventor Maria Rzeznik

Maria Rzeznik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
    Patent number: 11761107
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: September 19, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND AND BISEPOXOIDES
    Publication number: 20210205052
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: February 4, 2020
    Publication date: July 8, 2021
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen CHEN, Maria RZEZNIK
  • Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides
    Patent number: 10738388
    Abstract: Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: August 11, 2020
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND AND BISEPOXOIDES
    Publication number: 20200179087
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: February 4, 2020
    Publication date: June 11, 2020
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen CHEN, Maria RZEZNIK
  • Copper electroplating baths containing reaction products of aminex, polyacrylamides and bisepoxides
    Patent number: 10662541
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: May 26, 2020
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND SULTONES
    Publication number: 20200149176
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: January 17, 2020
    Publication date: May 14, 2020
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen Chen, Maria RZEZNIK
  • Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
    Patent number: 10604858
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: March 31, 2020
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Copper electroplating baths containing compounds of reaction products of amines and quinones
    Patent number: 10590556
    Abstract: A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: March 17, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Nitrogen containing polymers as levelers
    Patent number: 10196751
    Abstract: Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: February 5, 2019
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Zuhra I. Niazimbetova, Chen Chen, Tong Sun, Maria Rzeznik
  • Polymers containing benzimidazole moieties as levelers
    Patent number: 10201097
    Abstract: Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: February 5, 2019
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Yang Li, Tong Sun, Shaoguang Feng, Chen Chen, Zuhra Niazimbetova, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINEX, POLYACRYLAMIDES AND BISEPOXIDES
    Publication number: 20180245228
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 30, 2018
    Inventors: Weijing LU, Lingli DUAN, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND SULTONES
    Publication number: 20180237931
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 23, 2018
    Inventors: Weijing LU, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND POLYACRYLAMIDES
    Publication number: 20180237929
    Abstract: Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 23, 2018
    Inventors: Weijing LU, Lingli DUAN, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND QUINONES
    Publication number: 20180237930
    Abstract: A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 23, 2018
    Inventors: Weijing LU, Lingli DUAN, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts
    Patent number: 9918389
    Abstract: Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: March 13, 2018
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Rzeznik
  • Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
    Patent number: 9914115
    Abstract: Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: March 13, 2018
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kristen M. Milum, Donald E. Cleary, Maria A. Rzeznik
  • HORIZONTAL METHOD OF ELECTROLESS METAL PLATING OF SUBSTRATES WITH IONIC CATALYSTS
    Publication number: 20170251557
    Abstract: Horizontal methods of electroless metal plating with ionic catalysts have improved plating performance by reducing undesired foaming. The reduced foaming prevents loss of ionic catalyst from the catalyst bath and prevents scum formation which inhibits catalyst performance. The horizontal methods also inhibit ionic catalyst precipitation and improve adhesion of the ionic catalyst to the substrate. The horizontal method can be used to plate through-holes and vias of various types of substrates.
    Type: Application
    Filed: February 29, 2016
    Publication date: August 31, 2017
    Inventors: Feng Liu, Maria Rzeznik
  • ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRIMIDINE DERIVATIVE CONTAINING CATALYSTS
    Publication number: 20170175272
    Abstract: Pyrimidine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.
    Type: Application
    Filed: September 4, 2014
    Publication date: June 22, 2017
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Kristen Milum, Maria Rzeznik, Donald Cleary, Julia Kozhukh, Zukhra Niazimbetova
  • ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRAZINE DERIVATIVE CONTAINING CATALYSTS
    Publication number: 20170156216
    Abstract: Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.
    Type: Application
    Filed: September 4, 2014
    Publication date: June 1, 2017
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Rzeznik
  • Stable catalysts for electroless metallization
    Patent number: 9611549
    Abstract: Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: April 4, 2017
    Assignee: Rphm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Rzeznik