Abstract: The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.

Abstract: Disclosed are compositions containing a pigment mixture and a binder. The pigment mixture contains a non-ionic platy filler and at least a second pigment material. The non-ionic platy filler may be present in an amount of 1% by weight to 9% by weight and the at least one second pigment material may be present in an amount of at least 30% by weight based on total weight of the pigment mixture. The at least one second pigment material may have a weighted average oil absorption of 20 g linseed oil absorbed per 100 g at least one second pigment material to 100 g linseed oil absorbed per 100 g at least one second pigment material based on total weight of the pigment mixture. Also disclosed are articles comprising an adhesive comprising one of the compositions in an at least partially dried state positioned between first and second substrates.

Abstract: Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.

Abstract: Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

Abstract: The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m.K measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m·K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.

Abstract: Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.

Abstract: The present invention is directed to a sealing composition comprising: (a) a polysiloxane; (b) a reactive polysiloxane comprising at least one reactive functional group; and (c) water; wherein the weight ratio of polysiloxane to reactive polysiloxane is from 2.7:1 to 4:1. Also disclosed are coated substrates and methods of coating a substrate.

Abstract: The present invention relates to a substrate having (a) a first material applied to at least a portion of the substrate, and (b) a coating layer deposited from a powder coating composition including a film-forming resin, and optionally a thermally conductive, electrically insulative filler material and/or a crosslinker that is reactive with the film-forming resin, in direct contact with at least a portion of the substrate to which the first material has been applied. The first material is (i) a catalyst that catalyzes cure of the powder coating composition, (ii) a component reactive with the film-forming resin and/or the crosslinker of the powder coating composition, and/or (iii) a rheology modifier.

Abstract: The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.

Abstract: The present invention is directed towards a powder coating composition comprising a binder; a thermally conductive, electrically insulative filler material; and, optionally, a thermoplastic material and/or a core-shell polymer. The present invention is also directed to a substrate comprising a coating layer deposited from the powder coating composition of the present invention, as well as methods of coating a substrate.

Abstract: Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.

Abstract: The present invention is directed to compositions comprising a first component, a second component, and elastomeric particles. The first component comprises an epoxy-containing compound. The second component comprises a diamine comprising a cyclic ring and/or a polyamine comprising a cyclic ring. The diamine may chemically react with the epoxy-containing compound. Optionally, the cyclic ring of the diamine and/or the polyamine has at least one carbon positioned between the amino functional groups and the cyclic ring structure. Optionally, at least 50% by weight of the elastomeric particles comprise a styrene butadiene core based on total weight of the elastomeric particles. The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.

Abstract: Disclosed are systems for treating a substrate comprising a deoxidizing composition and a coating composition. The deoxidizing composition comprises a Group IVA metal and/or a Group IVB metal and free fluoride, optionally may comprise a homopolymer or copolymer comprising a phosphorous-containing monomeric subunit, and has a pH of 1.0 to 3.0. The coating composition comprises first and second components and elastomeric particles. The first component comprises an epoxy-containing compound (E1) and/or an epoxide-functional adduct (E2). The second component comprises a diamine and/or a polyamine comprising a cyclic ring (A2) and/or an amine-functional adduct (A3). The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.

Abstract: Disclosed is an epoxide-functional adduct (E2) and an amine-functional adduct (A3) and coating compositions including these adducts. The epoxide-functional adduct (E2) comprises a reaction product of a reaction mixture comprising (a) an epoxy-containing compound (E1) and (b) a diamine comprising a cyclic ring and/or a polyamine comprising a cyclic ring (A1). The amine-functional adduct comprises a reaction product of a reaction mixture comprising the epoxy-functional adduct (E2) and a monoamine, diamine, and/or polyamine (A2), wherein the monoamine, diamine, and/or polyamine (A2) are different than the diamine comprising a cyclic ring and/or the polyamine comprising a cyclic ring (A1). The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.

Abstract: Disclosed herein is an adhesive composition that includes a resin composition and an epoxy-containing compound. The resin composition includes an epoxidized polysulfide and an epoxidized oil. The epoxidized polysulfide is present in the adhesive composition in a weight ratio to the epoxidized oil of 20:1 to 1:1. Also disclosed is the adhesive composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the adhesive composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the adhesive composition in an at least partially cured state.

Abstract: Disclosed are systems for treating a substrate comprising a deoxidizing composition and a coating composition. The deoxidizing composition comprises a Group IVA metal and/or a Group IVB metal and free fluoride, optionally may comprise a homopolymer or copolymer comprising a phosphorous-containing monomeric subunit, and has a pH of 1.0 to 3.0. The coating composition comprises first and second components and elastomeric particles. The first component comprises an epoxy-containing compound. The second component comprises a diamine and/or a polyamine comprising a cyclic ring. The diamine may chemically react with the epoxy-containing compound. The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.

Abstract: The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m K (measured according to ASTM D7984) and a volume resistivity of at least 10 ?m (measured according to ASTM D257, C611, or B 193) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m·K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.

Abstract: Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.

Abstract: The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.

Abstract: Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.