Abstract: A system having an electrode probe and a temperature sensing device, wherein the temperature sensing device is positionable within the electrode probe. The probe can have an elongate electrode body, at least two electrode contacts disposed on the electrode body, and a lumen defined within the electrode body, and the temperature sensing device can have an elongate outer body having a lumen, an elongate inner sensing body disposed within the lumen, and at least one temperature sensor disposed on the elongate inner sensing body. The system in certain embodiments can also have a controller configured to receive temperature information from the temperature sensing device and use the temperature information to adjust energy supply to at least one of the at least two electrode contacts.

Abstract: Methods and devices for implanting spinal cord stimulation devices, including thin-film spinal cord stimulation devices. In some embodiments, the devices include an introduction needle and/or sheath, a stylet, and a pushing device for urging a stimulation device into the epidural space by controlling the proximal end of the device, including, in some cases, deformable thin-film spinal cord stimulation devices. Further implementations include a deployment device for ensuring deployment of the stimulation device in the epidural space. In other embodiments, the devices include sutures attached to a distal portion of the stimulation device, at least one introduction tube, a lead introduction device, and/or a suture introduction device for urging a stimulation device into the epidural space by controlling both the proximal and distal ends of the device, including, in some cases, deformable thin-film spinal cord stimulation devices.

Abstract: Various deformable thin film spinal cord stimulation devices that are deformable to conform to the shape and/or movement of the target spinal cord. Each device embodiment has an electrode body with at least one deformation section disposed longitudinally within the electrode body and at least one electrode contact. Some implementations have a distal structure that can be formed into a pusher receiving structure such as a pocket or a collar.

Abstract: A flexible implantable electrode arrangement includes an electrically insulating carrier structure of a first polymer material, an electrically conductive layer, and an electrically insulating cover layer of a second polymer material. The electrically conductive layer includes an electrically conductive carbon fiber layer. The electrically conductive layer integrally forms an implantable electrode, a conductor track connected to the implantable electrode, and a contact pad. The electrically insulating cover layer at least partially covers the electrically conductive layer.

Abstract: Microelectromechanical system are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof. Contemplated systems are suitable for ?-ECoG arrays. Additional microelectromechanical systems are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof; at least one substrate, surface, layer or a combination thereof, wherein the at least one electrode, microelectrode or combination thereof is disposed on, coupled with or otherwise layered on the at least one substrate, surface, layer or a combination thereof; and at least one bump pad, wherein the at least one electrode, microelectrode or combination thereof is coupled with the at least one bump pad via at least one conductive metal.

Abstract: Microelectromechanical system are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof. Contemplated systems are suitable for ?-ECoG arrays. Additional microelectromechanical systems are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof; at least one substrate, surface, layer or a combination thereof, wherein the at least one electrode, microelectrode or combination thereof is disposed on, coupled with or otherwise layered on the at least one substrate, surface, layer or a combination thereof; and at least one bump pad, wherein the at least one electrode, microelectrode or combination thereof is coupled with the at least one bump pad via at least one conductive metal.

Abstract: Microelectromechanical system are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof. Contemplated systems are suitable for ?-ECoG arrays. Additional microelectromechanical systems are disclosed that include at least one electrode, microelectrode or combination thereof, wherein the at least one electrode comprises a carbon material, a glassy carbon material or a combination thereof; at least one substrate, surface, layer or a combination thereof, wherein the at least one electrode, microelectrode or combination thereof is disposed on, coupled with or otherwise layered on the at least one substrate, surface, layer or a combination thereof; and at least one bump pad, wherein the at least one electrode, microelectrode or combination thereof is coupled with the at least one bump pad via at least one conductive metal.