Patents by Inventor Maria Xenidou

Maria Xenidou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low application temperature hot melt adhesive
    Patent number: 10138398
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: November 27, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20180148615
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 31, 2018
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 9914857
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: March 13, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Block-copolymer containing crosslinkable photoinitator groups
    Patent number: 9670295
    Abstract: A block-copolymer containing at least two different blocks wherein block A contains (meth)acrylate monomers the copolymer having a glass transition temperature of less than 15° C., block B contains (meth)acrylate monomers the copolymer having a glass transition temperature of more than 25° C. being free of thio-containing substances in the polymer chain, characterized in that one block contains at least one photoinitiator chemically bound to the chain.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: June 6, 2017
    Assignees: Henkel AG & Co. KGaA, Evonik Röhm GmbH
    Inventors: Peter D. Palasz, Maria Xenidou, Kerstin van Wijk, Simon Krause, Stefan Hilf
  • Low temperature hot melt adhesives for disposable articles with high creep resistance
    Patent number: 9296930
    Abstract: The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: March 29, 2016
    Assignee: Henkel IP & Holding GmbH
    Inventors: Yuhong Hu, Maria Xenidou
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20150322302
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: Yuhong HU, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 9115299
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: August 25, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa Dejesus
  • LOW TEMPERATURE HOT MELT ADHESIVES FOR DISPOSABLE ARTICLES WITH HIGH CREEP RESISTANCE
    Publication number: 20150159060
    Abstract: The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers.
    Type: Application
    Filed: February 12, 2015
    Publication date: June 11, 2015
    Inventors: Yuhong Hu, Maria Xenidou
  • Low temperature hot melt adhesives for disposable articles with high creep resistance
    Patent number: 8987372
    Abstract: The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 24, 2015
    Assignee: Henkel US IP & Holding GmbH
    Inventors: Yuhong Hu, Maria Xenidou
  • Hot melt adhesive comprising cyanoacrylate curing compounds
    Patent number: 8877868
    Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl (meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: November 4, 2014
    Assignees: Henkel IP & Holding GmbH, Henkel US IP LLC
    Inventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
  • HOT MELT ADHESIVE COMPRISING CYANOACRYLATE CURING COMPOUNDS
    Publication number: 20140238603
    Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Applicants: Henkel AG & Co. KGaA, Henkel Ireland Limited, Henkel Corporation
    Inventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20140171586
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: February 24, 2014
    Publication date: June 19, 2014
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa Dejesus
  • Low application temperature hot melt adhesive
    Patent number: 8702900
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: April 22, 2014
    Assignee: Henkel US IP LCC
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, M. Cristina B. DeJesus
  • Low Application Temperature Hot Melt Adhesive
    Publication number: 20120149827
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: February 20, 2012
    Publication date: June 14, 2012
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, M. Cristina B. DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 7795336
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: September 14, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
  • Low application temperature hot melt adhesive
    Patent number: 7683114
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: March 23, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
  • Low application temperature hot melt adhesive
    Publication number: 20070173153
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Application
    Filed: March 12, 2007
    Publication date: July 26, 2007
    Inventors: Charles Paul, Matthew Sharak, Leisa Ryan, Maria Xenidou, Michael Harwell, Qiwei He
  • Low application temperature hot melt adhesive
    Publication number: 20040077240
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Application
    Filed: October 18, 2002
    Publication date: April 22, 2004
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He