Patents by Inventor Marianne Romansky

Marianne Romansky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal Treatment for Preconditioning or Restoration of a Solder Joint
    Publication number: 20230249272
    Abstract: A thermal treatment method for conditioning or restoring bismuth containing lead-free solder in a solder joint assembly. The method comprising heating the solder in the assembly to a temperature near the solvus.
    Type: Application
    Filed: September 26, 2022
    Publication date: August 10, 2023
    Inventors: Polina Snugovsky, Eva Kosiba, Jeffrey K. Kennedy, David Hillman, David Adams, Stephan Meschter, Doug D. Perovic, Michael O. Robinson, Joseph Juarez, Ivan Straznicky, Leonid Snugovsky, Marianne Romansky
  • Thermal Treatment for Preconditioning or Restoration of a Solder Joint
    Publication number: 20180345395
    Abstract: A thermal treatment method for conditioning or restoring bismuth containing lead-free solder in a solder joint assembly. The method comprising heating the solder in the assembly to a temperature near the solvus.
    Type: Application
    Filed: August 10, 2018
    Publication date: December 6, 2018
    Inventors: Polina SNUGOVSKY, Eva KOSIBA, Jeffrey K. KENNEDY, David HILLMAN, David ADAMS, Stephan MESCHTER, Doug D. PEROVIC, Michael O. ROBINSON, Joseph JUAREZ, Ivan STRAZNICKY, Leonid SNUGOVSKY, Marianne ROMANSKY
  • SOLDER ALLOY FOR LOW-TEMPERATURE PROCESSING
    Publication number: 20150258636
    Abstract: A solder composition is provided comprising from about 5.5 to 7.0 percent by weight of bismuth, from about 2.0 to 2.5 percent by weight of silver, from about 0.5 to 0.7 percent by weight of copper, and the remainder of the composition being tin. The use of the solder composition and an electronic device comprising the solder composition are also provided.
    Type: Application
    Filed: October 4, 2013
    Publication date: September 17, 2015
    Applicant: Celestica International Inc.
    Inventors: Polina Snugovsky, Simin Bagheri, Marianne Romansky, Leonid Snugovsky, Doug Perovic
  • Low Melting Temperature Solder Alloy
    Publication number: 20130259738
    Abstract: A solder composition is provided. The solder composition consists essentially of from about 6.0 to 7.5 percent by weight of bismuth, from about 0.5 to 0.7 percent by weight of copper, and the remainder of the composition being tin.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Inventors: Polina SNUGOVSKY, Simin Bagheri, Marianne Romansky, Leonid Snugovsky, Doug Perovic