Patents by Inventor Marie E. Borucki

Marie E. Borucki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for thermal isolation in vertically-integrated semiconductor devices
    Patent number: 7414316
    Abstract: A semiconductor structure (100) includes a first substrate (110) having a first semiconductor device (112) formed therein, a second substrate (120) having a second device (122) formed therein and vertically-integrated above the first substrate (110), and a thermal isolation gap (130) disposed between the first device (112) and the second device (122). The thermal isolation gap (130) may be formed, for example, using an etched dielectric layer formed on first substrate (110), using an etched cavity in the second substrate (120), or by including a bonding layer (140) that has a gap or void incorporated therein.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: August 19, 2008
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Lianjun Liu, Marie E. Borucki