Patents by Inventor Marie Mitchel

Marie Mitchel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for chemical mechanical planarization (CMP) and chemical mechanical cleaning (CMC) of a work piece
    Patent number: 6875087
    Abstract: A method is provided for planarizing/polishing and subsequently in situ cleaning a surface of a work piece such as a semiconductor wafer. The method includes the steps of planarizing/polishing the surface of a work piece by subjecting a work piece surface to a chemical mechanical planarization/polishing (CMP) process on a chemical mechanical planarization/polishing platen such that the planarization/polishing process leaves the surface of the work piece hydrophobic. The planarization/polishing process is followed by a chemical mechanical cleaning (CMC) process in which the planarized/polished surface of the work piece is subjected to the cleaning process on the same chemical mechanical planarization/polishing platen such that the cleaning process leaves the surface of the work piece hydrophilic.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: April 5, 2005
    Assignee: Novellus Systems, Inc.
    Inventors: Marie Mitchel, John L. Shartel, II, Yakov Epshteyn
  • Method for chemical mechanical planarization (CMP) and chemical mechanical cleaning (CMC) of a work piece
    Publication number: 20040229550
    Abstract: A method is provided for planarizing/polishing and subsequently in situ cleaning a surface of a work piece such as a semiconductor wafer. The method includes the steps of planarizing/polishing the surface of a work piece by subjecting a work piece surface to a chemical mechanical planarization/polishing (CMP) process on a chemical mechanical planarization/polishing platen such that the planarization/polishing process leaves the surface of the work piece hydrophobic. The planarization/polishing process is followed by a chemical mechanical cleaning (CMC) process in which the planarized/polished surface of the work piece is subjected to the cleaning process on the same chemical mechanical planarization/polishing platen such that the cleaning process leaves the surface of the work piece hydrophilic.
    Type: Application
    Filed: May 13, 2003
    Publication date: November 18, 2004
    Inventors: Marie Mitchel, John L. Shartel, Yakov Epshteyn