Patents by Inventor Marie-Solange Anne Milleron

Marie-Solange Anne Milleron has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package and method
    Patent number: 9527728
    Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: December 27, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Matthew David Romig, Marie-Solange Anne Milleron, Benjamin Michael Sutton
  • INTEGRATED CIRCUIT PACKAGE METHOD
    Publication number: 20160096727
    Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate using epoxy die attachment film. A wafer level assembly and an integrated circuit package are also described.
    Type: Application
    Filed: December 14, 2015
    Publication date: April 7, 2016
    Inventors: Matthew David Romig, Marie-Solange Anne Milleron, Benjamin Michael Sutton
  • INTEGRATED CIRCUIT PACKAGE AND METHOD
    Publication number: 20150021721
    Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 22, 2015
    Applicant: Texas Instruments Incorporated
    Inventors: Matthew David Romig, Marie-Solange Anne Milleron, Benjamin Michael Sutton
  • Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate
    Patent number: 8723337
    Abstract: A semiconductor chip (101) with bond pads (110) on a substrate (103) with rows and columns of regularly pitched metal contact pads (131). A zone comprises a first pair (131a, 131b) and a parallel second pair (131c, 131d) of contact pads, and a single contact pad (131e) for ground potential; staggered pairs of stitch pads (133) connected to respective pairs of adjacent contact pads by parallel and equal-length traces (132a, 132b, etc.). Parallel and equal-length bonding wires (120a, 120b, etc.) connect bond pad pairs to stitch pad pairs, forming differential pairs of parallel and equal-length conductor lines. Two differential pairs in parallel and symmetrical position form a transmitter/receiver cell for conducting high-frequency signals.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: May 13, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Gregory E. Howard, Matthew D. Romig, Marie-Solange Anne Milleron, Souvik Mukherjee
  • Structure for High-Speed Signal Integrity in Semiconductor Package with Single-Metal-Layer Substrate
    Publication number: 20130134579
    Abstract: A semiconductor chip (101) with bond pads (110) on a substrate (103) with rows and columns of regularly pitched metal contact pads (131). A zone comprises a first pair (131a, 131b) and a parallel second pair (131c, 131d) of contact pads, and a single contact pad (131e) for ground potential; staggered pairs of stitch pads (133) connected to respective pairs of adjacent contact pads by parallel and equal-length traces (132a, 132b, etc.). Parallel and equal-length bonding wires (120a, 120b, etc.) connect bond pad pairs to stitch pad pairs, forming differential pairs of parallel and equal-length conductor lines. Two differential pairs in parallel and symmetrical position form a transmitter/receiver cell for conducting high-frequency signals.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 30, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Gregory E. Howard, Matthew D. Romig, Marie-Solange Anne Milleron, Souvik Mukherjee