Abstract: Integrated circuit structures having uniform grid metal gate and trench contact cut, and methods of fabricating integrated circuit structures having uniform grid metal gate and trench contact cut, are described. For example, an integrated circuit structure includes a vertical stack of horizontal nanowires. A gate electrode is over the vertical stack of horizontal nanowires. A conductive trench contact is adjacent to the gate electrode. A dielectric sidewall spacer is between the gate electrode and the conductive trench contact. A first dielectric cut plug structure extends through the gate electrode, through the dielectric sidewall spacer, and through the conductive trench contact. A second dielectric cut plug structure extends through the gate electrode, through the dielectric sidewall spacer, and through the conductive trench contact, the second dielectric cut plug structure laterally spaced apart from and parallel with the first dielectric cut plug structure.

Abstract: A scattered light point spread function is measured for use in fabricating microelectronic and micromechanical devices using photolithography. In one example, a photosensitive layer of a microelectronic substrate is exposed through a test mask, the test mask having a series of differently sized patterns, each pattern surrounding a central monitor feature, the differently sized patterns each being evenly distributed about its respective central monitor feature. An indication of the exposure of the photosensitive layer is measured for a plurality of the series of differently sized patterns. The exposure indication is compared to the pattern size. The comparison is fitted to a function and the function is applied in correcting photolithography mask layouts.

Abstract: A scattered light point spread function is measured for use in fabricating microelectronic and micromechanical devices using photolithography. In one example, a photosensitive layer of a microelectronic substrate is exposed through a test mask, the test mask having a series of differently sized patterns, each pattern surrounding a central monitor feature, the differently sized patterns each being evenly distributed about its respective central monitor feature. An indication of the exposure of the photosensitive layer is measured for a plurality of the series of differently sized patterns. The exposure indication is compared to the pattern size. The comparison is fitted to a function and the function is applied in correcting photolithography mask layouts.