Patents by Inventor Mariela Reynoso Castillo

Mariela Reynoso Castillo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular packaging with elevating screw
    Patent number: 9857397
    Abstract: Modular packaging includes a solid state relay and a function module, wherein the function module comprises a housing containing a printed circuit board and an elevating screw. The elevating screw comprises a first end with an external threading and a second end with an external threading, where the elevating screw may be selectively altered between a first position and a second position within the housing. Related embodiments are disclosed.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: January 2, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Oscar Rivera Hernandez, Mariela Reynoso Castillo, Ismael Favela Duran
  • Modular Packaging with Elevating Screw
    Publication number: 20170295653
    Abstract: Modular packaging includes a solid state relay and a function module, wherein the function module comprises a housing containing a printed circuit board and an elevating screw. The elevating screw comprises a first end with an external threading and a second end with an external threading, where the elevating screw may be selectively altered between a first position and a second position within the housing. Related embodiments are disclosed.
    Type: Application
    Filed: April 7, 2016
    Publication date: October 12, 2017
    Inventors: Oscar Rivera Hernandez, Mariela Reynoso Castillo, Ismael Favela Duran