Patents by Inventor Mariia Rozhavskaia

Mariia Rozhavskaia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11901483
    Abstract: An optoelectronic semiconductor structure (SC) comprises an active InGaN-based layer disposed between an n-type injection layer and a p-type injection layer, the active p-type injection layer comprising a first InGaN layer and, disposed on the first layer, a second layer composed of a plurality of AlGaInN elemental layers, each elemental layer having a thickness less than its critical relaxation thickness, two successive elemental layers having different aluminum and/or indium and/or gallium compositions.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: February 13, 2024
    Assignee: Soitec
    Inventor: Mariia Rozhavskaia
  • Publication number: 20220140190
    Abstract: An optoelectronic semiconductor structure comprises an InGaN-based active layer disposed between an n-type injection layer and a p-type injection layer, the p-type injection layer comprising a first InGaN layer having a thickness between 50 and 350 nm and, disposed on the first layer, a second layer having a GaN surface portion.
    Type: Application
    Filed: February 25, 2020
    Publication date: May 5, 2022
    Inventors: David Sotta, Mariia Rozhavskaia, Benjamin Daminlano
  • Publication number: 20220093822
    Abstract: An optoelectronic semiconductor structure (SC) comprises an active InGaN-based layer disposed between an n-type injection layer and a p-type injection layer, the active p-type injection layer comprising a first InGaN layer and, disposed on the first layer, a second layer composed of a plurality of Al—GaInN elemental layers, each elemental layer having a thickness less than its critical relaxation thickness, two successive elemental layers having different aluminum and/or indium and/or gallium compositions.
    Type: Application
    Filed: December 26, 2019
    Publication date: March 24, 2022
    Inventor: Mariia Rozhavskaia
  • Publication number: 20220059720
    Abstract: A process for fabricating a growth substrate comprises preparing a donor substrate by forming a crystalline semiconductor surface layer on a seed layer of a carrier. This preparation comprises forming the surface layer as a plurality of alternations of an InGaN primary layer and of an AlGaN secondary layer, the indium concentration and the thickness of the primary layers and the aluminum concentration and the thickness of the secondary layers being selected so that a homogeneous AlInGaN layer that is equivalent, in terms of concentration of aluminum and indium-, to the surface layer has a natural lattice parameter different from the lattice parameter of the seed layer.
    Type: Application
    Filed: November 29, 2019
    Publication date: February 24, 2022
    Inventors: Jean-Marc Bethoux, Mariia Rozhavskaia