Abstract: A passive alignment system includes a base substrate, a lower cladding layer disposed over the base substrate, a core layer disposed over the lower cladding layer, and an upper cladding layer disposed over the core layer. The passive alignment system also includes one or more planar waveguides including one or more cores formed in a first portion of the core layer disposed over a first portion of the lower cladding layer, the one or more cores extending from a transmitting end to a receiving end in an X-Y plane. The passive alignment system also includes at least one alignment feature formed in a second portion of the core layer disposed over a second portion of the lower cladding layer and configured to align with an optical receiving or transmitting device. The at least one alignment feature aligns the optical receiving or transmitting device with the one or more planar waveguides.

Abstract: The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.

Abstract: The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.