Abstract: Memories, and their operation, might include a plurality of content addressable memory (CAM) cells each for storing a respective data value, a match signal generator configured to generate an indication whether each CAM cell of the plurality of CAM cells indicates a match between its respective data value and a respective received signal value, and a plurality of storage elements each for storing a respective data value, wherein each storage element of the plurality of storage elements corresponds to a respective CAM cell of the plurality of CAM cells in a one-to-one relationship, and wherein each storage element of the plurality of storage elements is responsive to the indication of the match signal generator to generate a data signal indicative of the respective data value of that storage element if a match of their corresponding CAM cells is indicated.

Abstract: Memories, and their operation, might include a plurality of content addressable memory (CAM) cells each for storing a respective data value, a match signal generator configured to generate an indication whether each CAM cell of the plurality of CAM cells indicates a match between its respective data value and a respective received signal value, and a plurality of storage elements each for storing a respective data value, wherein each storage element of the plurality of storage elements corresponds to a respective CAM cell of the plurality of CAM cells in a one-to-one relationship, and wherein each storage element of the plurality of storage elements is responsive to the indication of the match signal generator to generate a data signal indicative of the respective data value of that storage element if a match of their corresponding CAM cells is indicated.

Abstract: A semiconductor storage device includes a cell array including resistance change elements formed above a semiconductor substrate; first cell transistors formed on the semiconductor substrate and provided in association with the resistance change elements; first gate electrodes included in the first cell transistor and extending in a first direction; a first bit lines electrically connected to the resistance change elements respectively and extending in a second direction perpendicular to the first direction; a second bit lines electrically connected to one end of a current path of the first cell transistors respectively and extending in the second direction; and first active areas in which the first cell transistors are formed, and which extend in a direction crossing the first direction at a first angle.

Abstract: A first normal bit and source lines are connected to a first memory cell. Second normal bit and source lines are connected to a second memory cell. A first column switch connects one of the first and second normal bit lines to a first global bit line. A second column switch connects one of the first and second normal source lines to a first global source line. A first reference bit and source lines are connected to a third memory cell. A third column switch connects the first reference bit line to a second global bit line. A fourth column switch connects the first reference source line to the first global source line. A sense amplifier is connected to the first and second global bit lines, and reads data stored in one of the first and second memory cells.

Abstract: A semiconductor storage device includes a cell array including resistance change elements formed above a semiconductor substrate; first cell transistors formed on the semiconductor substrate and provided in association with the resistance change elements; first gate electrodes included in the first cell transistor and extending in a first direction; a first bit lines electrically connected to the resistance change elements respectively and extending in a second direction perpendicular to the first direction; a second bit lines electrically connected to one end of a current path of the first cell transistors respectively and extending in the second direction; and first active areas in which the first cell transistors are formed, and which extend in a direction crossing the first direction at a first angle.

Abstract: A memory device according to an embodiment includes a first memory cell array; a second memory cell array; and a multiplexer arranged between the first memory cell array and the second memory cell array, the multiplexer controlling the first memory cell array and the second memory cell array.

Abstract: A first normal bit and source lines are connected to a first memory cell. Second normal bit and source lines are connected to a second memory cell. A first column switch connects one of the first and second normal bit lines to a first global bit line. A second column switch connects one of the first and second normal source lines to a first global source line. A first reference bit and source lines are connected to a third memory cell. A third column switch connects the first reference bit line to a second global bit line. A fourth column switch connects the first reference source line to the first global source line. A sense amplifier is connected to the first and second global bit lines, and reads data stored in one of the first and second memory cells.

Abstract: According to one embodiment, first normal bit and source lines are connected to a first memory cell. Second normal bit and source lines are connected to a second memory cell. A first column switch connects one of the first and second normal bit lines to a first global bit line. A second column switch connects one of the first and second normal source lines to a first global source line. A first reference bit and source lines are connected to a third memory cell. A third column switch connects the first reference bit line to a second global bit line. A fourth column switch connects the first reference source line to the first global source line. A sense amplifier is connected to the first and second global bit lines, and reads data stored in one of the first and second memory cells.

Abstract: A resistance change type memory device according to an embodiment includes a plurality of memory elements; a first to a fourth bit lines connected to the plurality of memory elements, respectively; a first to a fourth transistors connected at their one ends to the first to the fourth bit lines, respectively; a fifth transistor connected at its one end to the other ends of the first and second transistors; a sixth transistor connected at its one end to the other ends of the third and fourth transistors; and a fifth bit line connected to the other ends of the fifth and sixth transistors.

Abstract: A memory device according to an embodiment includes a first memory cell array; a second memory cell array; and a multiplexer arranged between the first memory cell array and the second memory cell array, the multiplexer controlling the first memory cell array and the second memory cell array.

Abstract: A semiconductor memory device includes: a bank including a normal area including normal columns, and a redundancy area including redundancy columns and to be replaced with a failure column of the normal area; sense amplifiers connected to the normal area; and a redundancy sense amplifier connected to the redundancy area. A normal replacement unit is formed of normal columns allocated to each of the sense amplifiers. A redundancy replacement unit is formed of redundancy columns allocated to the redundancy sense amplifier. The redundancy replacement unit is smaller than the normal replacement unit.

Abstract: According to one embodiment, first normal bit and source lines are connected to a first memory cell. Second normal bit and source lines are connected to a second memory cell. A first column switch connects one of the first and second normal bit lines to a first global bit line. A second column switch connects one of the first and second normal source lines to a first global source line. A first reference bit and source lines are connected to a third memory cell. A third column switch connects the first reference bit line to a second global bit line. A fourth column switch connects the first reference source line to the first global source line. A sense amplifier is connected to the first and second global bit lines, and reads data stored in one of the first and second memory cells.

Abstract: According to one embodiment, a semiconductor storage device includes a cell array including resistance change elements formed above a semiconductor substrate; first cell transistors formed on the semiconductor substrate and provided in association with the resistance change elements; first gate electrodes included in the first cell transistor and extending in a first direction; a first bit lines electrically connected to the resistance change elements respectively and extending in a second direction perpendicular to the first direction; a second bit lines electrically connected to one end of a current path of the first cell transistors respectively and extending in the second direction; and first active areas in which the first cell transistors are formed, and which extend in a direction crossing the first direction at a first angle.

Abstract: A semiconductor memory device includes: a bank including a normal area including normal columns, and a redundancy area including redundancy columns and to be replaced with a failure column of the normal area; sense amplifiers connected to the normal area; and a redundancy sense amplifier connected to the redundancy area. A normal replacement unit is formed of normal columns allocated to each of the sense amplifiers. A redundancy replacement unit is formed of redundancy columns allocated to the redundancy sense amplifier. The redundancy replacement unit is smaller than the normal replacement unit.

Abstract: A memory cell array of a first semiconductor chip includes a normal cell array and a spare cell array. A first defect address data storage circuit outputs first defect address data indicating an address of a defective memory cell in the memory cell array. A first comparison circuit compares address data with the first defect address data and outputs a first match signal in case of matching. A second defect address data storage circuit outputs second defect address data indicating an address of a defective memory cell in the memory cell array. A second comparison circuit compares the address data with the second defect address data and outputs a second match signal in case of matching.

Abstract: A memory cell array of a first semiconductor chip includes a normal cell array and a spare cell array. A first defect address data output circuit outputs first defect address data indicating an address of a defective memory cell in the memory cell array. A first comparison circuit compares address data with the first defect address data and outputs a first match signal in case of matching. A second defect address data output circuit outputs second defect address data indicating an address of a defective memory cell in the memory cell array. A second comparison circuit compares the address data with the second defect address data and outputs a second match signal in case of matching.

Abstract: A synchronous type semiconductor storage device includes an array unit which includes a cell array and sense amplifiers. The synchronous type semiconductor storage device includes a read/write pulse generator which generates a read pulse signal and a write pulse signal according to a clock signal, the clock signal defining one cycle time of a read operation and a write operation with respect to the array unit as one cycle. The synchronous type semiconductor storage device includes a secondary amplifier which is activated according to the read pulse signal to read out data stored in the sense amplifiers through the read/write line. The synchronous type semiconductor storage device includes a write driver which is activated according to the write pulse signal to write data in the sense amplifiers through the read/write line.

Abstract: A memory cell array of a first semiconductor chip includes a normal cell array and a spare cell array. A first defect address data storage circuit outputs first defect address data indicating an address of a defective memory cell in the memory cell array. A first comparison circuit compares address data with the first defect address data and outputs a first match signal in case of matching. A second defect address data storage circuit outputs second defect address data indicating an address of a defective memory cell in the memory cell array. A second comparison circuit compares the address data with the second defect address data and outputs a second match signal in case of matching.

Abstract: A memory cell array of a first semiconductor chip includes a normal cell array and a spare cell array. A first defect address data output circuit outputs first defect address data indicating an address of a defective memory cell in the memory cell array. A first comparison circuit compares address data with the first defect address data and outputs a first match signal in case of matching. A second defect address data output circuit outputs second defect address data indicating an address of a defective memory cell in the memory cell array. A second comparison circuit compares the address data with the second defect address data and outputs a second match signal in case of matching.