Patents by Inventor Mariko Nakagawa

Mariko Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230294957
    Abstract: A power transmission unit includes a plurality of power transmission coils provided along a hoistway and at least one power transmission device that supplies power to each of a plurality of power transmission coils. A power reception unit includes a plurality of power reception coils provided on a surface of a car opposite to the power transmission coil and at least one power reception device that receives the power from each of power reception coils. The plurality of power transmission coils include at least a first power transmission coil and a second power transmission coil. A length of the second power transmission coil in a traveling direction of the car is longer than a length of the first power transmission coil.
    Type: Application
    Filed: September 4, 2020
    Publication date: September 21, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Mariko NAKAGAWA, Tomokazu SAKASHITA, Takuya MIURA
  • Publication number: 20230035821
    Abstract: A bus bar module includes a bus bar electrically connect electrode terminals respectively included in a plurality of battery cells, and a detection conductor electrically connected to the bus bar. The bus bar includes: a pair of electrode joining parts respectively joined to the different electrode terminals; a coupling part coupling the pair of electrode joining parts to each other, and capable of being cut between the pair of electrode joining parts where the pair of electrode joining parts is respectively joined to the electrode terminals; and a pair of rejoinable parts respectively extending from the pair of electrode joining parts. The electrode joining parts and the coupling part constitute a conductive connection part for primary use disposed across the different electrode terminals to electrically connect the different electrode terminals to each other.
    Type: Application
    Filed: July 25, 2022
    Publication date: February 2, 2023
    Applicant: Yazaki Corporation
    Inventors: Tatsuya OGA, Hirotaka MUKASA, Mariko NAKAGAWA, Kazuhiko TSUCHIYA
  • Publication number: 20220416563
    Abstract: An elevator includes: a car moving in a hoistway; a load provided to the car; a first power storage unit, composed of one battery capable of charging and discharging, connected to the load, and supplying power to the load; a second power storage unit, composed of one or more batteries capable of charging and discharging, and connected to the load; a power transmission circuit and capable of transmitting power between the first power storage unit and the second power storage unit; and a control unit controlling the power transmission circuit to supply power from the second power storage unit to the first power storage unit, when it is determined that a remaining stored power amount of the battery constituting the first power storage unit is less than an amount of power required for driving the load for a certain period of time.
    Type: Application
    Filed: March 30, 2020
    Publication date: December 29, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Mariko NAKAGAWA, Tomokazu SAKASHITA, Miyuki TAKESHITA, Hidehito YOSHIDA, Hirohisa KUWANO, Takuya MIURA
  • Publication number: 20220259008
    Abstract: A wireless power supply system for elevators includes a power transmitting device, first and second power receiving devices provided in the first and second elevator cars respectively, and a control device. The power transmitting device includes power transmitting units each having an inverter and two power transmitter coils. The first power receiving device includes first power receiving units each having a rectifier circuit and a power receiver coil that can be coupled with one of the two power transmitter coils. The second power receiving device includes second power receiving units each having a rectifier circuit and a power receiver coil that can be coupled with the other of the two power transmitter coils. The power transmitting device, or the first and second power receiving devices include switches to disconnect the inverter and the first load device as well as the inverter and the second load device.
    Type: Application
    Filed: July 19, 2019
    Publication date: August 18, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Mariko NAKAGAWA, Tomokazu SAKASHITA, Miyuki TAKESHITA, Hidehito YOSHIDA, Hirohisa KUWANO, Takuya MIURA
  • Patent number: 11349233
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of connection portions is larger than a second fillet width of another solder among the solder fillets located in an outside region of one of the pair of connection portions, which is on a side opposite to the inside region across the one of the pair of connection portions.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 31, 2022
    Assignee: Yazaki Corporation
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Patent number: 11166382
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: November 2, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Patent number: 11088422
    Abstract: A method for manufacturing a laminated bus bar includes a first base member forming process of forming a plurality of first through-holes in a conductive flat plate-shaped first base member, a second base member forming process of forming a conductive flat plate-shaped second base member, a laminating process of forming a laminated body configured by laminating and fixing flat surfaces of the first base member and the second base member on and to each other, and a punching process of forming, in the second base member of the laminated body, second through-holes forming pairs with the first through-holes, the second through-holes being smaller than the first through-holes in portions overlapping with the first through-holes in a lamination direction of the first base member and the second base member.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: August 10, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Tatsuya Oga, Yoshiaki Ichikawa, Mariko Nakagawa
  • Publication number: 20210151915
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of the connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of the connection portions is larger than a second fillet width of another one solder among the solder fillets located in an outside region on an opposite side to the inside region across the connection portions.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 20, 2021
    Applicant: Yazaki Corporation
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Publication number: 20210136925
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.
    Type: Application
    Filed: November 5, 2020
    Publication date: May 6, 2021
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Publication number: 20210043909
    Abstract: A method for manufacturing a laminated bus bar includes a first base member forming process of forming a plurality of first through-holes in a conductive flat plate-shaped first base member, a second base member forming process of forming a conductive flat plate-shaped second base member, a laminating process of forming a laminated body configured by laminating and fixing flat surfaces of the first base member and the second base member on and to each other, and a punching process of forming, in the second base member of the laminated body, second through-holes forming pairs with the first through-holes, the second through-holes being smaller than the first through-holes in portions overlapping with the first through-holes in a lamination direction of the first base member and the second base member.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 11, 2021
    Inventors: Tatsuya Oga, Yoshiaki Ichikawa, Mariko Nakagawa