Patents by Inventor Mariko OHARA

Mariko OHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11694938
    Abstract: A semiconductor device includes a case enclosing a region filled with a sealing material. The case is made of resin. An electrode is fixed to the case. A section, which is a part of the electrode, is provided with a cutout that allows a part of the resin making the case to be exposed to the region.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: July 4, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Mariko Ohara, Masatake Harada, Akira Goto
  • SEMICONDUCTOR DEVICE
    Publication number: 20200144146
    Abstract: A semiconductor device includes a case enclosing a region filled with a sealing material. The case is made of resin. An electrode is fixed to the case. A section, which is a part of the electrode, is provided with a cutout that allows a part of the resin making the case to be exposed to the region.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 7, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Mariko OHARA, Masatake HARADA, Akira GOTO