Patents by Inventor Marilyn J. Stuckey

Marilyn J. Stuckey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor and method of fabrication
    Patent number: 6326228
    Abstract: A sensor (10) includes a cavity (31) formed by a substrate (11), an adhesive (21), and a filter (22). A sensing element (14) is located inside the cavity (31) while electrical contacts (17, 18) coupled to the sensing element (14) are located outside the cavity (31). The filter (22) protects the sensing element (14) from physical damage and contamination during die singulation and other assembly processes. The filter (22) also improves the chemical sensitivity, selectivity, response times, and refresh times of the sensing element (14).
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: December 4, 2001
    Assignee: Motorola, Inc.
    Inventors: Henry G. Hughes, Marilyn J. Stuckey, Margaret L. Kniffin, Ping-chang Lue
  • Sensor and method of fabrication
    Patent number: 5798556
    Abstract: A sensor (10) includes a cavity (31) formed by a substrate (11), an adhesive (21), and a filter (22). A sensing element (14) is located inside the cavity (31) while electrical contacts (17, 18) coupled to the sensing element (14) are located outside the cavity (31). The filter (22) protects the sensing element (14) from physical damage and contamination during die singulation and other assembly processes. The filter (22) also improves the chemical sensitivity, selectivity, response times, and refresh times of the sensing element (14).
    Type: Grant
    Filed: March 25, 1996
    Date of Patent: August 25, 1998
    Assignee: Motorola, Inc.
    Inventors: Henry G. Hughes, Marilyn J. Stuckey, Margret L. Kniffin, Ping-chang Lue
  • Semiconductor wafer level package
    Patent number: 5323051
    Abstract: A semiconductor wafer level package used to encapsulate a device fabricated on a semiconductor substrate wafer before dicing of the wafer into individual chips. A cap wafer is bonded to the semiconductor substrate wafer using a pre-patterned frit glass as a bonding agent such that the device is hermetically sealed inside a cavity. A hole in the cap wafer allows electrical connections to be made to the device through electrodes which pass through the frit glass seal.
    Type: Grant
    Filed: December 16, 1991
    Date of Patent: June 21, 1994
    Assignee: Motorola, Inc.
    Inventors: Victor J. Adams, Paul T. Bennett, Henry G. Hughes, Brooks L. Scofield, Jr., Marilyn J. Stuckey