Patents by Inventor Marilyn S. Highland

Marilyn S. Highland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging for populated circuit boards
    Patent number: 5195302
    Abstract: A package system for populated circuit boards is disclosed. The circuit board is placed on a piece of conductive paperboard and is shrink wrapped with an antistatic film, which may be provided with a tearstrip. Placed on a cardboard carton, the package provides good protection against physical shocks, vibration and electrostatic discharge.
    Type: Grant
    Filed: October 21, 1991
    Date of Patent: March 23, 1993
    Assignee: Adaptec, Incorporated
    Inventors: Patricio J. Collantes, Jr., Marilyn S. Highland, Sam Kazarian