Patents by Inventor Mario A. Perez

Mario A. Perez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12247294
    Abstract: Device for solidifying a coating layer hot deposited on a wire, corresponding installation and method. The device comprises a cooling liquid injection chamber with a liquid inlet and a wire inlet, a cooling chamber with a liquid outlet and a wire outlet, and a partition arranged between the injection and cooling chambers, comprising a wire passage. It also has a conduit for separating the wire. The partition comprises channels fluidically connecting the injection chamber with the cooling chamber and leading into the center of the wire passage in an eccentric manner and being inclined forming an angle (?) with respect to a longitudinal direction. This directs a jet of cooling liquid on the wire in the direction from the injection chamber towards the cooling chamber.
    Type: Grant
    Filed: September 20, 2023
    Date of Patent: March 11, 2025
    Assignee: DRUIDS PROCESS TECHNOLOGY, S.L.
    Inventors: Raimon Pérez Soldevila, Mario Gregorio Angeloni, Albert Puigcorbé Alcalà
  • Publication number: 20250065701
    Abstract: A vehicle side door assembly includes a first beam, a second beam, and a bolster spanning from the first beam to the second beam. The bolster can be nylon. The bolster can include a grid of ribs that establish an array of pockets on an outboard side of the bolster, and a grid of ribs that establish another array of pockets on an inboard side of the bolster.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Inventors: Mario Martin Avila Rodriguez, Ruben Gallardo, Gabriel Perez Lopez, Alan Cardenas, Victor Manuel Delgado Romero, Francisco Mauricio Munoz, Jorge Aurelio Martinez
  • Publication number: 20250001586
    Abstract: An exoskeleton system that comprises: one or more actuator units, the one or more actuator units including an actuator; one or more sensors; and an exoskeleton device that includes: an actuation system, and a processor and memory, the memory storing instructions, that when executed by the processor, are configured to control the exoskeleton system to: cause actuation of the actuator of the one or more actuator units.
    Type: Application
    Filed: September 13, 2024
    Publication date: January 2, 2025
    Inventors: Mario Perez, Kyle Kaveny, Ronald Lam, Kris Li, Collin Smith, Linus Park, Scott Schoeffel, Kevin Conrad Kemper, Timothy Alan Swift
  • Publication number: 20250001734
    Abstract: Adhesive compositions, articles, and methods are described. The electronic may comprise: i) a conductive metallic substrate; ii) an insulating resin layer; and iii) and an adhesive layer disposed between the substrate and insulating resin layer. The adhesive layer comprises at least 50 wt. % of polyimide resin comprising maleimide moieties; and at least 0.25 wt. % of an amine compound. In some embodiments, the conductive metallic substrate comprises copper, such as copper traces.
    Type: Application
    Filed: August 30, 2024
    Publication date: January 2, 2025
    Inventors: Ralph R. Roberts, Claire Hartmann-Thompson, Gregory P. Sorenson, Erik M. Townsend, Mario A. Perez
  • Patent number: 12115663
    Abstract: An exoskeleton system, the exoskeleton system comprising one or more actuator units that include a fluidic actuator, one or more sensors and an exoskeleton device. The exoskeleton device includes a fluidic system, and a processor and memory, the memory storing instructions, that when executed by the processor, are configured to control the exoskeleton system to introduce fluid to the fluidic actuator of the one or more actuator units to cause actuation of the fluidic actuator of the one or more actuator units. The exoskeleton system may be configured to operate in, on or around a body of water and can be water and/or corrosion resistant.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: October 15, 2024
    Assignee: Roam Robotics Inc.
    Inventors: Mario Perez, Kyle Kaveny, Ronald Lam, Kris Li, Collin Smith, Linus Park, Scott Schoeffel, Kevin Conrad Kemper, Timothy Alan Swift
  • Patent number: 12086741
    Abstract: Crowd funding for innovation includes distributing a proposal with a description of a project idea, an amount of funds requested, and a time frame for raising the funds. Ownership of the project is transferred to an entity, which receives contributions from contributors and for each of the received contributions converts the contribution to a corresponding amount of virtual coin and adds the contribution to the funds. If the funding goal is complete within the time frame, the entity converts the coins to actual money and releases the money to the requestor. After completion of the project, the entity determines if the project is successful and can commercialize successful projects. For certain successful projects, the entity can also distribute funds to the contributors.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: September 10, 2024
    Assignee: Solventum Intellectual Properties Company
    Inventors: Audrey A. Sherman, Robert R. Kieschke, Frank J. Sherman, Mario A. Perez, Raymond P. Johnston, Kandyce M. Bohannon
  • Publication number: 20240239991
    Abstract: A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.
    Type: Application
    Filed: July 22, 2021
    Publication date: July 18, 2024
    Inventors: Jacob P. Podkaminer, Matthew H. Frey, Victor Ho, Matthew T. Johnson, Jeremy K. Larsen, Craig W. Lindsay, Kyle C. Picha, Mario A. Perez
  • Publication number: 20240002586
    Abstract: A curable composition comprises an addition polymerizable cycloolefin comprising a ring containing a single car-bon-carbon double bond; an addition polymerization catalyst; and at least one of hollow glass microspheres, expanded polymeric mi-crospheres, or expandable polymeric microspheres. The curable composition may be 1-part or 2-part. Methods of curing the curable composition are disclosed. Cured compositions, and articles including the same are also disclosed.
    Type: Application
    Filed: November 29, 2021
    Publication date: January 4, 2024
    Inventors: Binhong Lin, Mario A. Perez, Phillip D. Hustad, Erik M. Townsend
  • Publication number: 20230416445
    Abstract: A curable composition comprises at least one cyclic olefin capable of undergoing ring opening metathesis polymerization; at least one ring opening metathesis polymerization catalyst or precursor catalyst thereof; abrasive particles having surface hydroxyl groups; and a difunctional coupling agent represented by the structure Z-X-Z (I). Each Z independently represents a group that is chemically reactive with at least one of the surface hydroxyl groups of one of the abrasive particles thereby forming at least one covalent bond. X represents a divalent organic linking group have a number average molecular weight of 500 to 10000 grams per mole.
    Type: Application
    Filed: November 4, 2021
    Publication date: December 28, 2023
    Inventors: Mario A. Perez, Binhong Lin, Jaime A. Martinez
  • Publication number: 20230405971
    Abstract: An article comprises a substrate having a first portion comprising at least one of a metal or a ceramic metal oxide. A composite foam is bonded to the metal or ceramic metal oxide. The composite foam comprises: at least one polymer preparable by ring-opening metathesis polymerization; at least one catalyst for the ring-opening metathesis polymerization; at least one difunctional coupling agent represented by Z—X—Z. Each Z independently represents a group that is chemically reactive with at least one of the chemically bound surface hydroxyl groups thereby forming at least one covalent bond. Each X independently represents a divalent organic linking group having a number average molecular weight of 500 to 10000 grams per mole; and at least one of hollow glass microspheres or expanded polymeric microspheres. A method of making the article is also disclosed.
    Type: Application
    Filed: January 7, 2022
    Publication date: December 21, 2023
    Inventors: Mario A. Perez, Binhong Lin, Jeffrey P. Kalish, Erik M. Townsend
  • Publication number: 20230279271
    Abstract: A B-stage thermoset adhesive composition comprises components a) and b) in respective amounts of 10 to 40 percent by weight to 60 to 90 percent by weight. Component a) comprises at least one thermoplastic elastomer comprising a styrenic block copolymer. Component b) comprises a polymerized reaction product of at least one capable of undergoing ring-opening metathesis polymerization and at least one ring-opening olefin metathesis catalyst. A composite article including the B-stage thermoset adhesive and methods of making the composite article are also disclosed.
    Type: Application
    Filed: February 13, 2023
    Publication date: September 7, 2023
    Inventors: Mario A. Perez, Claire Hartmann-Thompson, Ralph R. Roberts
  • Patent number: 11731408
    Abstract: A multilayer film comprises first, second, and third layers. The first layer comprises at least one aromatic polyester, and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is thermoplastic and has a loss modulus at 1 hertz and 25° C. of less than or equal to 60 megapascals and comprises a thermoplastic elastomer and a polyamide. The third layer contacts the second layer opposite the first layer and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is sandwiched between the first and third layers. A method of making the multilayer film by coextrusion is also disclosed.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: August 22, 2023
    Assignee: 3M Innovative Properties Company
    Inventors: Mario A. Perez, Mary E. Johansen, Sebastian Goris, Lesbia E. Giron, Rajdeep S. Kalgutkar, Ta-Hua Yu, Paul T. Hines, Stephen A. Johnson
  • Publication number: 20230227709
    Abstract: A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.
    Type: Application
    Filed: June 8, 2021
    Publication date: July 20, 2023
    Inventors: Mario A. Perez, Jaime A. Martinez
  • Publication number: 20230053879
    Abstract: An exoskeleton system, the exoskeleton system comprising one or more actuator units that include a fluidic actuator, one or more sensors and an exoskeleton device. The exoskeleton device includes a fluidic system, and a processor and memory, the memory storing instructions, that when executed by the processor, are configured to control the exoskeleton system to introduce fluid to the fluidic actuator of the one or more actuator units to cause actuation of the fluidic actuator of the one or more actuator units. The exoskeleton system may be configured to operate in, on or around a body of water and can be water and/or corrosion resistant.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 23, 2023
    Inventors: Mario Perez, Kyle Kaveny, Ronald Lam, Kris Li, Collin Smith, Linus Park, Scott Schoeffel, Kevin Conrad Kemper, Timothy Alan Swift
  • Publication number: 20230012969
    Abstract: A composition is described comprising a cyclic olefin; a ring opening metathesis polymerization catalyst; and at least 40 wt. % of thermally conductive particles. The thermally conductive particles are selected such that the composition after curing has a thermal conductivity of at least 1W/M*K. In one embodiment, the thermally conductive particle comprises a combination of smaller and larger thermally conductive particles. In another embodiment, the thermally conductive particles comprise boron nitride particles. Also described are (e.g. structural) adhesives, methods of bonding and articles.
    Type: Application
    Filed: October 2, 2020
    Publication date: January 19, 2023
    Inventors: Mario A. Perez, Li Yao, Eumi Pyun, Binhong Lin, Michael A. Kropp, Kalc C. Vang, Matthew J. Kryger
  • Publication number: 20230014501
    Abstract: Adhesive composition and articles are described comprising a carrier substrate (e.g. release liner or backing) and an adhesive composition disposed on the carrier substrate. The adhesive composition comprises at least 20 wt.% of a polymer; unpolymerized cyclic olefin; and a (e.g. latent) ring opening metathesis polymerization catalyst or precatalyst thereof. The polymer may have a Tg less than 25° C. and/or may be an acrylic polymer. Also described is a method of bonding.
    Type: Application
    Filed: December 11, 2020
    Publication date: January 19, 2023
    Inventors: Erik M. Townsend, Kelly A. Volp, Mario A. Perez, Binhong Lin
  • Publication number: 20220380628
    Abstract: An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.
    Type: Application
    Filed: October 8, 2020
    Publication date: December 1, 2022
    Inventors: Binhong Lin, Mario A. Perez, Erik M. Townsend, Michael A. Kropp, Nelson T. Rotto, Kalc C. Vang, Surender Maddela, Lianzhou Chen
  • Publication number: 20220347982
    Abstract: A multilayer film comprises first, second, and third layers. The first layer comprises at least one aromatic polyester, and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is thermoplastic and has a loss modulus at 1 hertz and 25° C. of less than or equal to 60 megapascals and comprises a thermoplastic elastomer and a polyamide. The third layer contacts the second layer opposite the first layer and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is sandwiched between the first and third layers. A method of making the multilayer film by coextrusion is also disclosed.
    Type: Application
    Filed: September 18, 2020
    Publication date: November 3, 2022
    Inventors: Mario A. Perez, Mary E. Johansen, Sebastian Goris, Lesbia E. Giron, Rajdeep S. Kalgutkar, Ta-Hua Yu, Paul T. Hines, Stephen A. Johnson
  • Publication number: 20220259398
    Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a multiplicity of thermally-conductive particles and a multiplicity of magnetic particles distributed within the (co)polymeric network structure; wherein the thermally-conductive particles, magnetic particles and optional magnetic particles are present in a range from 15 to 99 weight percent, based on the total weight of the particles and the (co)polymer (excluding the solvent). Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing thermal interface materials that also provide magnetic properties useful, for example, in flux field directional materials or shielding from electromagnetic interference.
    Type: Application
    Filed: May 9, 2020
    Publication date: August 18, 2022
    Inventors: Sebastian Goris, Derek J. Dehn, Paul T. Hines, Michael S. Graff, JR., Mario A. Perez, Charles L. Bruzzone, Bharat R. Acharya, Clinton P. Waller
  • Publication number: 20220259465
    Abstract: A core-sheath filament having a) a core that is a thermally conductive pressure-sensitive adhesive particles and b) a non-tacky, thermoplastic sheath is provided. The thermally conductive pressure-sensitive adhesive in the core includes a (meth)acrylate-based polymeric material and thermally conductive particles. Additionally, methods of making the core-sheath filament and methods of using the core-sheath filament to print a thermally conductive pressure-sensitive adhesive are described.
    Type: Application
    Filed: August 6, 2020
    Publication date: August 18, 2022
    Inventors: Alexander J. Kugel, Mario A. Perez, Sebastian Goris, Matthew H. Frey, Ross E. Behling, Mark E. Napierala, Thomas Q. Chastek, Jacob D. Young, Shaun M. West, Tomoaki Uchiya