Abstract: A method of applying a die attach material includes forming a wafer stencil by selectively removing on the back side of a wafer including a plurality of semiconductor die having an active top side a predetermined depth to form a recess having an inner circumference while not removing an outer most circumference of the wafer. The recess is filled with a B-stage adhesive material. The wafer is singulated to form a plurality singulated semiconductor die. The singulated semiconductor die is die attached back side down to a package substrate, and then the B-stage adhesive material is cured. The B-stage adhesive material across its full area generally has a minimum thickness of at least 20 ?m and a maximum thickness range of 6 ?m.