Abstract: A semiconductor die includes a structural body that has a power region and a peripheral region surrounding the power region. At least one power device is positioned in the power region. Trench-insulation means extend in the structural body starting from the front side towards the back side along a first direction, adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction orthogonal to the first direction. The trench-insulation means have an extension, in the second direction, greater than the thickness of the structural body along the first direction.

Abstract: An optoelectronic device includes a backlight panel illuminating a display panel. The backlight panel includes an array of light emitting pixels, each light emitting pixel having at least one subpixel with one or more light emitting diodes positioned on a substrate. The pixel further includes at least one photodetector positioned on the substrate and arranged to detect an amount of reflected light emitted by said subpixel and reflected by the display panel.

Abstract: An optoelectronic device includes a backlight panel illuminating a display panel. The backlight panel includes an array of light emitting pixels, with each light emitting pixel including at least one subpixel formed by one or more light emitting diodes positioned on a substrate. At least one photodetector is positioned on the substrate and arranged to detect an amount of reflected light emitted by said subpixel and reflected by the display panel.

Abstract: A method for mutual authentication that includes establishing a first inductive coupling between a wireless-power receiver and a wireless-power transmitter to transfer power from the wireless-power transmitter to the wireless-power receiver by a power signal and using the power signal to transmit a first response to a physically unclonable function to the wireless-power transmitter. The method further including generating a second response to the physically unclonable function and communicating information derived from the second response to initiate a mutual authentication process between the wireless-power receiver and the wireless-power transmitter during a subsequent inductive coupling.

Abstract: Driving a LED array includes determining total charge to be transferred to the LEDs during an image frame, and determining a number of drive pulses of equal width and amplitude that would drive the LEDs with nearly the total charge during display of the image frame. One of the drive pulses is modified so the drive pulses drive the LEDs with the total charge during display. If the width is greater than a minimum width and less than a maximum width, the LEDs are driven with the drive pulses. If the width is less than the minimum width and if an amplitude is greater than a minimum amplitude, the amplitude of the drive pulses is decremented. If the width is less than the minimum width and if the amplitude is equal to the minimum amplitude and if the number of drive pulses is greater than one, the number is decremented.

Abstract: A non-emissive display includes a backlight controller sending a pulse during each sub-frame of a plurality of frames to row and column drivers that drive backlight zones. The row drivers count each pulse to keep a pulse count total, and reset the pulse count total when it is equal to a first number indicating how many row drivers are present. Each row driver activates its channels and waits for a next pulse if the pulse count total is not equal to the first number and if the pulse count total is equal to a second number indicating in which sub-frame that first driver is to be activated. Each row driver waits for a next pulse if the pulse count total is not equal to the first number and the second number. Each column driver activates its channel in response to receipt of each pulse.

Abstract: A semiconductor die includes a structural body that has a power region and a peripheral region surrounding the power region. At least one power device is positioned in the power region. Trench-insulation means extend in the structural body starting from the front side towards the back side along a first direction, adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction orthogonal to the first direction. The trench-insulation means have an extension, in the second direction, greater than the thickness of the structural body along the first direction.

Abstract: A non-emissive display includes a backlight controller sending a pulse during each sub-frame of a plurality of frames to row and column drivers that drive backlight zones. The row drivers count each pulse to keep a pulse count total, and reset the pulse count total when it is equal to a first number indicating how many row drivers are present. Each row driver activates its channels and waits for a next pulse if the pulse count total is not equal to the first number and if the pulse count total is equal to a second number indicating in which sub-frame that first driver is to be activated. Each row driver waits for a next pulse if the pulse count total is not equal to the first number and the second number. Each column driver activates its channel in response to receipt of each pulse.

Abstract: A semiconductor die includes a structural body that has a power region and a peripheral region surrounding the power region. At least one power device is positioned in the power region. Trench-insulation means extend in the structural body starting from the front side towards the back side along a first direction, adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction orthogonal to the first direction. The trench-insulation means have an extension, in the second direction, greater than the thickness of the structural body along the first direction.

Abstract: A method includes determining a number of drive pulses of equal width and amplitude that would drive LEDs with a total charge during a frame. If the width of the drive pulses is greater than a minimum-width and less than a maximum-width, the LEDs are driven with the drive pulses. If the width of the drive pulses is less than the minimum-width and an amplitude of the drive pulses is greater than a minimum-amplitude, decrement the amplitude of the drive pulses and recalculate the width of the drive pulses so each drive pulse has the decremented amplitude and recalculated width. If the amplitude of the drive pulses is equal to the minimum-amplitude, reduce the number of drive pulses and recalculate the width and amplitude of the reduced number of drive pulses. If the amplitude of the drive pulses is equal to the minimum-amplitude, the LEDs are not driven.

Abstract: A method for mutual authentication that includes establishing a first inductive coupling between a wireless-power receiver and a wireless-power transmitter to transfer power from the wireless-power transmitter to the wireless-power receiver by a power signal and using the power signal to transmit a first response to a physically unclonable function to the wireless-power transmitter. The method further including generating a second response to the physically unclonable function and communicating information derived from the second response to initiate a mutual authentication process between the wireless-power receiver and the wireless-power transmitter during a subsequent inductive coupling.

Abstract: A semiconductor die includes a structural body that has a power region and a peripheral region surrounding the power region. At least one power device is positioned in the power region. Trench-insulation means extend in the structural body starting from the front side towards the back side along a first direction, adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction orthogonal to the first direction. The trench-insulation means have an extension, in the second direction, greater than the thickness of the structural body along the first direction.

Abstract: A semiconductor die includes a structural body that has a power region and a peripheral region surrounding the power region. At least one power device is positioned in the power region. Trench-insulation means extend in the structural body starting from the front side towards the back side along a first direction, adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction orthogonal to the first direction. The trench-insulation means have an extension, in the second direction, greater than the thickness of the structural body along the first direction.

Abstract: A semiconductor die includes a structural body that has a power region and a peripheral region surrounding the power region. At least one power device is positioned in the power region. Trench-insulation means extend in the structural body starting from the front side towards the back side along a first direction, adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction orthogonal to the first direction. The trench-insulation means have an extension, in the second direction, greater than the thickness of the structural body along the first direction.