Patents by Inventor Mario Cesana

Mario Cesana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942580
    Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: March 26, 2024
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Simon Gubser, Mario Cesana, Markus Rossi, Hartmut Rudmann
  • Patent number: 11662541
    Abstract: This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: May 30, 2023
    Assignee: AMS Sensors Singapore PTE. Ltd.
    Inventors: Bojan Tesanovic, Mario Cesana, Camilla Camarri, Hartmut Rudmann
  • Patent number: 11575843
    Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: February 7, 2023
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Jukka Alasirnio, Tobias Senn, Ohad Meitav, Moshe Doron, Alireza Yasan, Mario Cesana, Florin Cutu, Hartmut Rudmann, Markus Rossi, Peter Roentgen, Daniel Perez Calero, Bassam Hallal, Jens Geiger
  • Publication number: 20220236381
    Abstract: An optical module (200) comprises an emitter (214) configured to emit electromagnetic radiation and a first substrate (212) configured to support the emitter (214). The optical module (200) further comprises a driver (220) configured to control the emitter (214) and a second substrate (216) configured to support the driver (220). The first substrate (212) has a greater thermal conductivity than the second substrate (216).
    Type: Application
    Filed: June 25, 2020
    Publication date: July 28, 2022
    Inventors: Lukas Steinmann, Hartmut Rudmann, Mario Cesana, Camilla Camarri
  • Publication number: 20220028908
    Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
    Type: Application
    Filed: October 11, 2021
    Publication date: January 27, 2022
    Inventors: Simon Gubser, Mario Cesana, Markus Rossi, Hartmut Rudmann
  • Patent number: 11145796
    Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: October 12, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Simon Gubser, Mario Cesana, Markus Rossi, Hartmut Rudmann
  • Patent number: 11013123
    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: May 18, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
  • Publication number: 20210014429
    Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
    Type: Application
    Filed: September 4, 2020
    Publication date: January 14, 2021
    Inventors: Jukka Alasirnio, Tobias Senn, Ohad Meitav, Moshe Doron, Alireza Yasan, Mario Cesana, Florin Cutu, Hartmut Rudmann, Markus Rossi, Peter Roentgen, Daniel Perez Calero, Bassam Hallal, Jens Geiger
  • Patent number: 10872999
    Abstract: An optoelectronic module includes first and second optical channels having respective active optoelectronic components. A transparent encapsulation is over the active optoelectronic components, and opaque encapsulation is on the transparent encapsulation. The opaque encapsulation has a first opening over a first active optoelectronic component and a second opening over a second optoelectronic component. The opaque encapsulation forms a ledge in an area of the second opening, and an optical assembly is disposed on the ledge within the second opening over the second optoelectronic component.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: December 22, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Camilla Camarri, Mario Cesana, Hartmut Rudmann
  • Publication number: 20200365778
    Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
    Type: Application
    Filed: July 2, 2020
    Publication date: November 19, 2020
    Inventors: Simon Gubser, Mario Cesana, Markus Rossi, Hartmut Rudmann
  • Publication number: 20200355885
    Abstract: This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.
    Type: Application
    Filed: October 25, 2018
    Publication date: November 12, 2020
    Applicant: ams Sensors Singapore Pte. Ltd
    Inventors: Bojan TESANOVIC, Mario CESANA, Camilla CAMARRI, Hartmut RUDMANN
  • Patent number: 10771714
    Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: September 8, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Jukka Alasirniö, Tobias Senn, Ohad Meitav, Moshe Doron, Alireza Yasan, Mario Cesana, Florin Cutu, Hartmut Rudmann, Markus Rossi, Peter Roentgen, Daniel Perez Calero, Bassam Hallal, Jens Geiger
  • Patent number: 10741736
    Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: August 11, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Simon Gubser, Mario Cesana, Markus Rossi, Hartmut Rudmann
  • Patent number: 10680023
    Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 9, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Mario Cesana, Jens Geiger, Peter Roentgen, Vincenzo Condorelli
  • Publication number: 20200127156
    Abstract: An optoelectronic module includes first and second optical channels having respective active optoelectronic components. A transparent encapsulation is over the active optoelectronic components, and opaque encapsulation is on the transparent encapsulation. The opaque encapsulation has a first opening over a first active optoelectronic component and a second opening over a second optoelectronic component. The opaque encapsulation forms a ledge in an area of the second opening, and an optical assembly is disposed on the ledge within the second opening over the second optoelectronic component.
    Type: Application
    Filed: February 17, 2017
    Publication date: April 23, 2020
    Inventors: Camila Camarri, Mario Cesana, Hartmut Rudmann
  • Publication number: 20200045828
    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
    Type: Application
    Filed: October 9, 2019
    Publication date: February 6, 2020
    Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
  • Patent number: 10547385
    Abstract: An optoelectronic module includes a transceiver operable to transmit data optically. The transceiver includes a light emitter to emit light from the module, and a light detector to detect light entering the module. The light detector is disposed at a rotationally symmetric position with respect to a central axis of the module. Such modules can help facilitate the exchange of data optically between two devices.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: January 28, 2020
    Assignee: AMS SENSORS SINGAPORE PTE. LTD.
    Inventors: Bassam Hallal, Hartmut Rudmann, Mario Cesana, Nicole Ebentheuer
  • Publication number: 20190326340
    Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
    Type: Application
    Filed: March 19, 2019
    Publication date: October 24, 2019
    Applicant: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Mario Cesana, Jens Geiger, Peter Roentgen, Vincenzo Condorelli
  • Patent number: 10373996
    Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: August 6, 2019
    Assignee: ams Sensors Singapore Pte. Ltd
    Inventors: Stephan Heimgartner, Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann, Jukka Alasirnio, Robert Lenart
  • Patent number: 10283542
    Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: May 7, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Mario Cesana, Jens Geiger, Peter Roentgen, Vincenzo Condorelli