Patents by Inventor Mario Ciminelli

Mario Ciminelli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LARGE AREA FLAT IMAGE SENSOR ASSEMBLY
    Publication number: 20080012082
    Abstract: A low temperature method for producing a substantially flat large area image sensor assembly, the method includes the steps of providing a die attach substrate having a substantially planar surface; providing a lead frame having a bonding surface and a plurality of leads extending there from; adhering an imager die to the substantially planar surface of the die attach substrate with a low curing temperature first adhesive; and adhering the die attach substrate with adhered imager die to a bonding surface of the lead frame with a low curing temperature second adhesive for producing an image sensor assembly.
    Type: Application
    Filed: August 8, 2007
    Publication date: January 17, 2008
    Inventors: Jaime Waldman, Mario Ciminelli, Michael Marcus
  • Large area flat image sensor assembly
    Publication number: 20050019987
    Abstract: A low temperature method for producing a substantially flat large area image sensor assembly, the method includes the steps of providing a die attach substrate having a substantially planar surface; providing a lead frame having a bonding surface and a plurality of leads extending there from; adhering an imager die to the substantially planar surface of the die attach substrate with a low curing temperature first adhesive; and adhering the die attach substrate with adhered imager die to a bonding surface of the lead frame with a low curing temperature second adhesive for producing an image sensor assembly.
    Type: Application
    Filed: August 20, 2004
    Publication date: January 27, 2005
    Inventors: Jaime Waldman, Mario Ciminelli, Michael Marcus
  • Method for producing an image sensor assembly
    Publication number: 20030054583
    Abstract: A method for producing an image sensor assembly, the method comprises the steps of providing a substrate having a substantially flat surface; providing a lead frame having a plurality of lead prongs extending therefrom and a shelf on which a coverglass may be attached; attaching an imager for collecting incident light to the substantially flat surface with an adhesive substance that adheres without thermal activation; and attaching the imager to a portion of the lead frame with an adhesive substance that adheres without thermal activation for producing an image sensor assembly.
    Type: Application
    Filed: September 20, 2001
    Publication date: March 20, 2003
    Applicant: Eastman Kodak Company
    Inventors: Jaime I. Waldman, Mario Ciminelli, Michael A. Marcus