Patents by Inventor Mario Dimarco

Mario Dimarco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7307851
    Abstract: An integrated modular avionics (IMA) cabinet for housing printed circuit board (PCB) modules includes a chassis configured with slots for receiving the PCB modules. The chassis of the IMA cabinet also includes a rear panel configured for connecting to connectors, wire harnesses, and the like. Additionally, the PCB modules include a front panel configured with screws for securing the PCB modules to the chassis of the IMA cabinet. The PCB modules also include retractable handles for transporting the PCB modules. The chassis of the IMA cabinet is also configured with ventilation holes for cooling the PCB modules. The IMA cabinet is further configured to be EMI/RFI resistant. In an exemplary embodiment, the IMA cabinet is configure such that substantially all of the electronic and/or computer components are disposed on the PCB modules and not in the IMA cabinet, thus reducing the overall cost of the IMA cabinet and facilitating easier and quicker reconfiguration, repair, and replacement of the PCB modules.
    Type: Grant
    Filed: December 31, 1998
    Date of Patent: December 11, 2007
    Assignee: Honeywell International Inc.
    Inventor: Mario Dimarco
  • Patent number: 6850415
    Abstract: An electronics cabinet is described as being suitable for use in an aircraft. Various embodiments of the cabinet include a databus that facilitates data communications between circuit boards inserted into the cabinet. The cabinet also preferably includes access holes that allow inserted circuit boards to connect directly to an aircraft wiring harness.
    Type: Grant
    Filed: December 31, 1998
    Date of Patent: February 1, 2005
    Assignee: Honeywell International Inc.
    Inventor: Mario Dimarco
  • Patent number: 6654253
    Abstract: An insertion extraction device (IED) (100) is suitable for use in attaching a movable object (40) to a fixed structure (20) with a limited amount of force. The IED (100) includes a mandrel (120) and a flexible sleeve (140). The mandrel (120) is constructed of a relatively hard material such as a metal and has a first section (126) with an elliptical, oval, or similar shape and a second section (128) for attaching to the fixed structure (20). The flexible sleeve (140) is constructed of a material such as nylon or urethane plastic. An operator is able to turn the mandrel (120) by turning the sleeve (140) with less than a certain amount of torque. When the operator applies an excessive amount of torque to the sleeve (140), the sleeve (140) slips over the mandrel (120), thereby limiting the maximum amount of force that can be applied to insert the movable component (40) into the fixed structure (20).
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: November 25, 2003
    Assignee: Honeywell International Inc.
    Inventor: Mario DiMarco
  • Patent number: 6356459
    Abstract: An EMI shielded enclosure for shielding an electrical component from electromagnetic radiation includes a first cover, a second cover, a top member having a first end, a second end, a first side face and a second side face, a bottom member having a first end, a second end, a first side face and a second side face, a front member connected to the first ends of the top member and the bottom member and having a first side face and second side face, and a back member connected to the second ends of the top member and the bottom member and having a first side face and a second side face. The first cover is attached to the first side faces of the front, back, bottom and top members, wherein at least one of the front, back, bottom and top members has a tapered first side face. The second cover is attached to the second side faces of the front, back, bottom and top members.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: March 12, 2002
    Assignee: Honeywell International Inc.
    Inventor: Mario DiMarco
  • Publication number: 20020012236
    Abstract: An electronics cabinet is described as being suitable for use in an aircraft. Various embodiments of the cabinet include a databus that facilitates data communications between circuit boards inserted into the cabinet. The cabinet also preferably includes access holes that allow inserted circuit boards to connect directly to an aircraft wiring harness.
    Type: Application
    Filed: December 31, 1998
    Publication date: January 31, 2002
    Inventor: MARIO DIMARCO
  • Publication number: 20020012237
    Abstract: An integrated modular avionics (IMA) cabinet for housing printed circuit board (PCB) modules includes a chassis configured with slots for receiving the PCB modules. The chassis of the IMA cabinet also includes a rear panel configured for connecting to connectors, wire harnesses, and the like. Additionally, the PCB modules include a front panel configured with screws for securing the PCB modules to the chassis of the IMA cabinet. The PCB modules also include retractable handles for transporting the PCB modules. The chassis of the IMA cabinet is also configured with ventilation holes for cooling the PCB modules. The IMA cabinet is further configured to be EMI/RFI resistant. In an exemplary embodiment, the IMA cabinet is configure such that substantially all of the electronic and/or computer components are disposed on the PCB modules and not in the IMA cabinet, thus reducing the overall cost of the IMA cabinet and facilitating easier and quicker reconfiguration, repair, and replacement of the PCB modules.
    Type: Application
    Filed: December 31, 1998
    Publication date: January 31, 2002
    Inventor: MARIO DIMARCO
  • Patent number: 6039581
    Abstract: A connector device provides an electrical connection between parallel mounted circuit card assemblies. On one circuit card assembly a male electrical connector is mounted which has electrical connection pins extending from it. On the other circuit card assembly is female electrical connector which has electrical connection holes which receive the connection pins. Mounted proximate to the male electrical connector is a connector guide which contacts at least two edges of the female electrical connector and guides the connector pins into the connector holes. The connector guide also extends above the connector pins and provides protection for the pins while the circuit card assembly is being handled.
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: March 21, 2000
    Assignee: Honeywell Inc.
    Inventor: Mario DiMarco
  • Patent number: 5304964
    Abstract: A connector has been designed that incorporates a ground EMI/RFI shield spacer in conjunction with an attached grounded multi-coplanar capacitor board to achieve an EMI/RFI tight grounded connection. The shield spacer may be provided with further RF suppression core members which surrounds all of the signal lines and power connections connected via the plug.
    Type: Grant
    Filed: January 8, 1993
    Date of Patent: April 19, 1994
    Assignee: Honeywell Inc.
    Inventor: Mario DiMarco
  • Patent number: 5268810
    Abstract: An electrical connector receptacle for allowing connection of electronic apparatus contained within a shielded enclosure to a multi-conductor wiring harness using a plug having a plurality of male pins arranged in a grid pattern is shown in which the connector receptacle includes a conductive connector receptacle shell defining a housing cavity having open front and rear faces dimensioned to receive the plug when inserted through the open front face. A multi-coplanar capacitor (MCC) layered structure having a front and a rear surface is connected with its front surface facing the rear surface of the connector receptacle and having a plurality of socket contacts arranged to receive the connector pins of the male plug. Separate individual pin planes define the MCC system each associated with a pair of ground planes connected to a common chassis ground.
    Type: Grant
    Filed: January 8, 1993
    Date of Patent: December 7, 1993
    Assignee: Honeywell Inc.
    Inventors: Mario DiMarco, Timothy J. Wilhelm
  • Patent number: 4644662
    Abstract: An inclinometer includes two coplanar electrodes positioned within a chamber of a metallic housing containing a high relative dielectric constant fluid and a gas. With the inclinometer positioned on a level surface equal areas of the two electrodes are immersed in the dielectric fluid creating two equal capacitors formed by the electrodes and the metallic housing. When the inclinometer is rotated through an inclination angle, unequal areas of the electrodes are immersed in the fluid causing a capacitance differential that is a measure of the inclination angle.
    Type: Grant
    Filed: April 29, 1986
    Date of Patent: February 24, 1987
    Assignee: Sperry Corporation
    Inventors: Jane E. Anderson, Harold L. Swartz, Mario DiMarco