Patents by Inventor Mario Eckert

Mario Eckert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting system for an enclosure, in particular for a loudspeaker
    Patent number: 10681440
    Abstract: The present invention relates to a mounting system (1), preferably for a loudspeaker enclosure, with an X-axis, a Y-axis and a Z-axis being defined that are respectively perpendicular to each other, comprising a support (2) having a first form-fit element (4) and a locking pin (6), and an enclosure (12) to be suspended with a second form-fit element (16) and a pin recess (18), wherein the two form-fit elements (4, 16) are insertable into each other along the X-axis for a locking state, and wherein the locking pin (6) engages in the pin recess (18) in the locking state, to block a relative movement between the support (2) and the enclosure (12) along the X-axis.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: June 9, 2020
    Assignee: Adam Hall GmbH
    Inventor: Mario Eckert
  • MOUNTING SYSTEM FOR AN ENCLOSURE, IN PARTICULAR FOR A LOUDSPEAKER
    Publication number: 20180206015
    Abstract: The present invention relates to a mounting system (1), preferably for a loudspeaker enclosure, with an X-axis, a Y-axis and a Z-axis being defined that are respectively perpendicular to each other, comprising a support (2) having a first form-fit element (4) and a locking pin (6), and an enclosure (12) to be suspended with a second form-fit element (16) and a pin recess (18), wherein the two form-fit elements (4, 16) are insertable into each other along the X-axis for a locking state, and wherein the locking pin (6) engages in the pin recess (18) in the locking state, to block a relative movement between the support (2) and the enclosure (12) along the X-axis.
    Type: Application
    Filed: January 17, 2018
    Publication date: July 19, 2018
    Inventor: Mario Eckert