Patents by Inventor Mario Engl

Mario Engl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor component and apparatus for production of a semiconductor component
    Patent number: 7838989
    Abstract: A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on the chip to the contact connecting pads. Signals are passed via these contact pads such that signals at high frequencies are passed via one or more contact pads and signals at low frequencies are passed via one or more contact pads. The chip is shifted on the substrate from a central position with respect to the totality of the contact connecting pads, so that the bonding wires for those contact pads via which signals at a high frequency are passed are shorter than bonding wires for those contact pads via which signals at low frequencies are passed.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: November 23, 2010
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Mario Engl, Horst Theuss
  • Semiconductor component and apparatus for production of a semiconductor component
    Publication number: 20070158860
    Abstract: A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on the chip to the contact connecting pads. Signals are passed via these contact pads such that signals at high frequencies are passed via one or more contact pads and signals at low frequencies are passed via one or more contact pads. The chip is shifted on the substrate from a central position with respect to the totality of the contact connecting pads, so that the bonding wires for those contact pads via which signals at a high frequency are passed are shorter than bonding wires for those contact pads via which signals at low frequencies are passed.
    Type: Application
    Filed: December 8, 2006
    Publication date: July 12, 2007
    Inventors: Jochen Dangelmaier, Mario Engl, Horst Theuss