Patents by Inventor Mario Heinze

Mario Heinze has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070123010
    Abstract: By performing a tilted amorphization implantation and a subsequent re-crystallization on the basis of a stressed overlying material, a highly efficient strain-inducing mechanism is provided. The tilted amorphization implantation may result in a significantly reduced defect rate during the re-crystallization process, thereby substantially reducing leakage currents in sophisticated transistor elements.
    Type: Application
    Filed: September 11, 2006
    Publication date: May 31, 2007
    Inventors: Jan Hoentschel, Andy Wei, Mario Heinze, Peter Javorka