Abstract: The present invention provides a method and apparatus for serial coolant flow control. In one embodiment of the present invention, two or more sets of angled rotating blades are used in series to increase the coolant pressure and flow. In this embodiment, the rotational direction of a set of blades is the reverse of the rotational direction of any set of blades next to it. In one embodiment, the angles of the blades are such that the forward velocity created by a set of blades is in the same direction as forward velocities created by other sets of blades in the system. In one embodiment, the blades of one set form a right angle with the blades of any set next to it. In one embodiment, the coolant flow controller is a fan. In another embodiment, the coolant is air. In yet another embodiment, the system being cooled is an electronic system.

Abstract: A computer system including a chassis, which directs cooling airflow to effectively cool electronic cards, such as PCI cards, positioned with a longitudinal axis perpendicular to the airflow, is disclosed. The chassis may include panels that substantially enclose the electronic cards therein. An opening positioned above the cards allows cooling air to flow into the chassis perpendicular to the longitudinal axis of the cards. Another opening allows cooling air to flow out of the chassis parallel to the orientation of the cards and into the existing cooling airflow of the system. The chassis module may be constructed in a computer system to allow increased flexibility of computer system configurations in which multiple cards, boards, or electronic components may need to be positioned perpendicularly to the existing cooling air flow in the system. The module may be implemented in large server systems as well as desktop personal computers without the need of additional cooling fans or vents.

Abstract: An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly process of this invention includes the steps of initially attaching a temporary heat slug to the back side of a package body, to which one or more semiconductor die are attached. The semiconductor die are then electrically connected to the package body and encapsulated to maintain fixed positions within the package cavity. The temporary heat slug is then moved and a final heat slug is attached to the package body and the back side of the one or more semiconductor dies utilizing a single layer of high conductivity adhesive. The package is compact, has reduced complexity, and is inexpensive to manufacture.

Abstract: A computer having a compact enclosure separated into two cooperative compartments, each having a pair of air fans for cooling electrical heat generating elements located in each compartment, the pair of fans being arranged on common sides of the compartments, one fan serving as a redundant fan on the failure of one of the other fans, the compartments are interconnected on opposite sides relative to the fans by an airflow plenum and separated by an airflow blockage wall in a manner that cooling air introduced into one compartment is circulated through both compartments before being exhausted from the other compartment.

Abstract: A redundant blower unit is installed in a rack above another unit containing heat-emitting electrical elements (such as CPU cards) in order to draw air through the underlying unit and out to atmosphere. Four blowers in the blower unit draw air from a plenum, each blower discharging into an individual exhaust duct leading to the exterior. Two blowers are positioned at a first tier relative to the bottom of the plenum and the other two at a second tier higher than the first tier. If one blower fails, its exhaust duct may malfunction as an air inlet, in which case the incoming air is mixed with exhaust air and discharged through the other blower in the same tier as the failed blower. Thus the efficiency of the two blowers in the other tier is not impeded.