Abstract: A method of fabricating a mounting substrate forming an ink inlet in a first layer of a first dielectric; forming contact pads on a second layer of a second dielectric; forming a slot through the second layer; forming a window through a third layer of a third dielectric; aligning and laminating the second layer to the first layer such that the ink inlet is aligned with the slot; and aligning and laminating the third layer to the second layer so the contact pads and the slot are exposed through the window; providing a printhead die having: a drop mechanism for ejecting drops; a chamber to contain ink; and adhesively bonding the printhead die to the second layer so that the printhead die is disposed within the window and an inlet feed opening of the printhead die is aligned with the slot through the second layer.

Abstract: An inkjet printhead includes a printhead die including: a mounting substrate on which the printhead die is mounted, the mounting substrate including: a base layer including a hole; an intermediate layer including: a first surface including a plurality of contact pads; a second surface opposite the first surface, the second surface being proximate the base layer; and a slot that is aligned with the hole in the base layer; and a face layer proximate the first surface of the intermediate layer, the face layer including a window, wherein the printhead die is disposed within the window such that an ink feed opening of the printhead die is in fluid communication with the slot in the intermediate layer of the mounting substrate; and a plurality of electrical interconnections connecting bond pads of the printhead die to the plurality of contact pads on the intermediate layer of the mounting substrate.

Abstract: A flexible printed wiring member includes a flexible insulating base layer; a patterned copper layer disposed on the insulating base layer, the patterned copper layer including: a first portion including unplated copper leads; and a second portion including a plated metal layer disposed on the patterned copper layer; a first insulating cover layer disposed over the unplated copper leads in the first portion, the first insulating cover layer terminating at a first edge located proximate a boundary between the first portion and the second portion of the patterned copper layer; and a second insulating cover layer disposed over the first insulating cover layer, the second insulating cover layer terminating at a second edge located within the second portion of the patterned copper layer.

Abstract: An inkjet printhead includes a printhead die including: a mounting substrate on which the printhead die is mounted, the mounting substrate including: a base layer including a hole; an intermediate layer including: a first surface including a plurality of contact pads; a second surface opposite the first surface, the second surface being proximate the base layer; and a slot that is aligned with the hole in the base layer; and a face layer proximate the first surface of the intermediate layer, the face layer including a window, wherein the printhead die is disposed within the window such that an ink feed opening of the printhead die is in fluid communication with the slot in the intermediate layer of the mounting substrate; and a plurality of electrical interconnections connecting bond pads of the printhead die to the plurality of contact pads on the intermediate layer of the mounting substrate.

Abstract: A method of fabricating a mounting substrate for a printhead die of an inkjet printhead, the method includes: forming an ink inlet hole in a first layer of a first dielectric material; patterning a plurality of electrical contact pads on a second layer of a second dielectric material; forming a slot through the second layer; forming a window through a third layer of a third dielectric material; aligning and laminating the second layer to the first layer such that the ink inlet hole is aligned with the slot; and aligning and laminating the third layer to the second layer such that the contact pads and the slot are exposed through the window.

Abstract: A flexible printed wiring member includes a flexible insulating base layer; a patterned copper layer disposed on the insulating base layer, the patterned copper layer including: a first portion including unplated copper leads; and a second portion including a plated metal layer disposed on the patterned copper layer; a first insulating cover layer disposed over the unplated copper leads in the first portion, the first insulating cover layer terminating at a first edge located proximate a boundary between the first portion and the second portion of the patterned copper layer; and a second insulating cover layer disposed over the first insulating cover layer, the second insulating cover layer terminating at a second edge located within the second portion of the patterned copper layer.

Abstract: A printhead has a substrate with a mounting surface for a printhead die. The printhead die includes a first face bonded to the mounting surface of the substrate and a second face opposite the first face. The second face including at least one array of marking elements disposed along a marking element array direction. An edge of the printhead die is substantially parallel to the marking element array direction. An inclined surface is positioned proximate to, but not overlapping the edge of the printhead die, wherein a distance from the inclined surface to the mounting surface of the substrate at a first location is greater than a distance from the inclined surface to the mounting surface of the substrate at a second location, the first location also being nearer the edge of the printhead die that is substantially parallel to the marking element array direction than the second location.

Abstract: A printhead has a substrate with a mounting surface for a printhead die. The printhead die includes a first face bonded to the mounting surface of the substrate and a second face opposite the first face. The second face including at least one array of marking elements disposed along a marking element array direction. An edge of the printhead die is substantially parallel to the marking element array direction. An inclined surface is positioned proximate to, but not overlapping the edge of the printhead die, wherein a distance from the inclined surface to the mounting surface of the substrate at a first location is greater than a distance from the inclined surface to the mounting surface of the substrate at a second location, the first location also being nearer the edge of the printhead die that is substantially parallel to the marking element array direction than the second location.