Abstract: An electrically conductive substrate is provided with a predetermined electrical pattern. A solder paste is deposited onto the electrically conductive substrate at pre-defined interconnection locations. A first encapsulant layer provided with a pattern of openings is placed onto the electrically conductive substrate. Back-contact solar cells are placed on the first encapsulant layer so as to have a match of the electrical pattern of the back-contact solar cells with the electrical pattern of the electrically conductive substrate. A second encapsulant layer is placed on the back-contact solar cells with a glass layer placed on the second encapsulant layer. Heat and pressure are applied to the components to cause the encapsulant materials to flow and form a monolithic photovoltaic module. A laser is applied to the solar cell from the side of the glass layer to cause the solder paste to reflow between each interconnection location and its matching connection location on the back-contact solar cell.