Abstract: The invention relates to a wafer chuck for handling a wafer, in particular in a wafer process device, further preferably in a scanning acoustic microscope, with a fixing device for the wafer, wherein the fixing device has a free space for receiving the wafer and a holder with multiple wafer contact fingers, which are movable relative to the holder for a wafer. The wafer contact fingers are arranged annularly around the free space for the wafer, preferably in one plane. The wafer contact fingers can be moved in the direction of the free space for the wafer or can be moved away from the free space for the wafer. One actuation device for the wafer contact fingers is provided and, when the actuation device is actuated, the wafer contact fingers are moved or can be moved simultaneously.

Abstract: The invention relates to an ultrasonic microscope for inspecting an object, comprising an object holder for holding the object in an object region; a scan head; a first transducer supported by the scan head and configured to emit first acoustic pulses along an emission direction, to focus the first acoustic pulses in a focal point, to detect second acoustic pulses emerging from the object and to output a first detection signal representing the second acoustic pulses detected by the first transducer; a first actuator configured to move the first transducer relative to the scan head along a vertical direction which is essentially parallel to the emission direction; and a controller configured to control the first actuator based on the first detection signal. Further, the invention relates to a carrier for carrying an acoustic pulse transducer of an ultrasonic microscope within an immersion liquid.