Patents by Inventor Mario MIRANDA ESPINOSA

Mario MIRANDA ESPINOSA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945508
    Abstract: A vehicle frame includes a first beam with a first wall and a second wall extended in a first beam longitudinal direction, wherein the first wall and the second wall are spaced from each other in a first beam transverse direction substantially perpendicular to the first beam longitudinal direction. The first beam includes at least one first beam reinforcement structure, the at least one first beam reinforcement structure including a first leg and a second leg disposed along the first beam and extended between the first wall and the second wall in the first beam transverse direction. The first leg and the second leg are angled toward each other along the first beam transverse direction from the second wall toward the first wall.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: April 2, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Eric J. Boettcher, Mario Miranda Espinosa, Vijay Maccha
  • Publication number: 20230011721
    Abstract: A vehicle frame includes a first beam with a first wall and a second wall extended in a first beam longitudinal direction, wherein the first wall and the second wall are spaced from each other in a first beam transverse direction substantially perpendicular to the first beam longitudinal direction. The first beam includes at least one first beam reinforcement structure, the at least one first beam reinforcement structure including a first leg and a second leg disposed along the first beam and extended between the first wall and the second wall in the first beam transverse direction. The first leg and the second leg are angled toward each other along the first beam transverse direction from the second wall toward the first wall.
    Type: Application
    Filed: July 7, 2022
    Publication date: January 12, 2023
    Inventors: Eric J. BOETTCHER, Mario MIRANDA ESPINOSA, Vijay MACCHA