Abstract: The present disclosure provides methods for treating or inhibiting the growth of MET associated non-small cell lung cancer comprising selecting a subject with cancer and administering a therapeutically effective amount of a MET x MET bispecific antibody where each binding arm of the bispecific antibody interacts with a different MET epitope. In certain embodiments, the cancer harbors a MET alteration such as an exon 14 alteration in DNA or a deletion that leads to exon 14 skipping, a MET gene amplification, or MET protein overexpression.

Abstract: A curable composition comprises an addition polymerizable cycloolefin comprising a ring containing a single car-bon-carbon double bond; an addition polymerization catalyst; and at least one of hollow glass microspheres, expanded polymeric mi-crospheres, or expandable polymeric microspheres. The curable composition may be 1-part or 2-part. Methods of curing the curable composition are disclosed. Cured compositions, and articles including the same are also disclosed.

Abstract: A curable composition comprises at least one cyclic olefin capable of undergoing ring opening metathesis polymerization; at least one ring opening metathesis polymerization catalyst or precursor catalyst thereof; abrasive particles having surface hydroxyl groups; and a difunctional coupling agent represented by the structure Z-X-Z (I). Each Z independently represents a group that is chemically reactive with at least one of the surface hydroxyl groups of one of the abrasive particles thereby forming at least one covalent bond. X represents a divalent organic linking group have a number average molecular weight of 500 to 10000 grams per mole.

Abstract: An article comprises a substrate having a first portion comprising at least one of a metal or a ceramic metal oxide. A composite foam is bonded to the metal or ceramic metal oxide. The composite foam comprises: at least one polymer preparable by ring-opening metathesis polymerization; at least one catalyst for the ring-opening metathesis polymerization; at least one difunctional coupling agent represented by Z—X—Z. Each Z independently represents a group that is chemically reactive with at least one of the chemically bound surface hydroxyl groups thereby forming at least one covalent bond. Each X independently represents a divalent organic linking group having a number average molecular weight of 500 to 10000 grams per mole; and at least one of hollow glass microspheres or expanded polymeric microspheres. A method of making the article is also disclosed.

Abstract: A B-stage thermoset adhesive composition comprises components a) and b) in respective amounts of 10 to 40 percent by weight to 60 to 90 percent by weight. Component a) comprises at least one thermoplastic elastomer comprising a styrenic block copolymer. Component b) comprises a polymerized reaction product of at least one capable of undergoing ring-opening metathesis polymerization and at least one ring-opening olefin metathesis catalyst. A composite article including the B-stage thermoset adhesive and methods of making the composite article are also disclosed.

Abstract: A multilayer film comprises first, second, and third layers. The first layer comprises at least one aromatic polyester, and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is thermoplastic and has a loss modulus at 1 hertz and 25° C. of less than or equal to 60 megapascals and comprises a thermoplastic elastomer and a polyamide. The third layer contacts the second layer opposite the first layer and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is sandwiched between the first and third layers. A method of making the multilayer film by coextrusion is also disclosed.

Abstract: A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.

Abstract: An exoskeleton system, the exoskeleton system comprising one or more actuator units that include a fluidic actuator, one or more sensors and an exoskeleton device. The exoskeleton device includes a fluidic system, and a processor and memory, the memory storing instructions, that when executed by the processor, are configured to control the exoskeleton system to introduce fluid to the fluidic actuator of the one or more actuator units to cause actuation of the fluidic actuator of the one or more actuator units. The exoskeleton system may be configured to operate in, on or around a body of water and can be water and/or corrosion resistant.

Abstract: Adhesive composition and articles are described comprising a carrier substrate (e.g. release liner or backing) and an adhesive composition disposed on the carrier substrate. The adhesive composition comprises at least 20 wt.% of a polymer; unpolymerized cyclic olefin; and a (e.g. latent) ring opening metathesis polymerization catalyst or precatalyst thereof. The polymer may have a Tg less than 25° C. and/or may be an acrylic polymer. Also described is a method of bonding.

Abstract: A composition is described comprising a cyclic olefin; a ring opening metathesis polymerization catalyst; and at least 40 wt. % of thermally conductive particles. The thermally conductive particles are selected such that the composition after curing has a thermal conductivity of at least 1W/M*K. In one embodiment, the thermally conductive particle comprises a combination of smaller and larger thermally conductive particles. In another embodiment, the thermally conductive particles comprise boron nitride particles. Also described are (e.g. structural) adhesives, methods of bonding and articles.

Abstract: An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.

Abstract: A multilayer film comprises first, second, and third layers. The first layer comprises at least one aromatic polyester, and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is thermoplastic and has a loss modulus at 1 hertz and 25° C. of less than or equal to 60 megapascals and comprises a thermoplastic elastomer and a polyamide. The third layer contacts the second layer opposite the first layer and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is sandwiched between the first and third layers. A method of making the multilayer film by coextrusion is also disclosed.

Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a multiplicity of thermally-conductive particles and a multiplicity of magnetic particles distributed within the (co)polymeric network structure; wherein the thermally-conductive particles, magnetic particles and optional magnetic particles are present in a range from 15 to 99 weight percent, based on the total weight of the particles and the (co)polymer (excluding the solvent). Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing thermal interface materials that also provide magnetic properties useful, for example, in flux field directional materials or shielding from electromagnetic interference.

Abstract: A core-sheath filament having a) a core that is a thermally conductive pressure-sensitive adhesive particles and b) a non-tacky, thermoplastic sheath is provided. The thermally conductive pressure-sensitive adhesive in the core includes a (meth)acrylate-based polymeric material and thermally conductive particles. Additionally, methods of making the core-sheath filament and methods of using the core-sheath filament to print a thermally conductive pressure-sensitive adhesive are described.

Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a multiplicity of thermally-conductive particles, and a multiplicity of endothermic particles distributed within the (co)polymeric network structure; wherein the thermally-conductive particles and endothermic particles are present in a range from 15 to 99 weight percent, based on the total weight of the particles and the (co)polymer (excluding the solvent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 10% of its initial volume when exposed to a temperature of at least 135° C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, as fillers, thermal interface materials, and thermal management materials, for example, in electronic devices, more particularly mobile handheld electronic devices, power supplies, and batteries.

Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a multiplicity of thermally-conductive particles, a multiplicity of intumescent particles and optionally a multiplicity of endothermic particles distributed within the (co)polymeric network structure; wherein the thermally-conductive particles, intumescent particles and optional endothermic particles are present in a range from 15 to 99 weight percent, based on the total weight of the particles and the (co)polymer (excluding the solvent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 50% over its initial volume when exposed to at least one temperature greater than 135° C. when exposed to at least one temperature greater than 135° C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, thermally-initiated fuses, and fire-stop devices.

Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a nonvolatile diluent, and a multiplicity of thermally-conductive particles distributed within the (co)polymeric network; wherein the thermally-conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the (co)polymer matrix (including the thermally-conductive particles and the nonvolatile diluent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 10% of its initial volume when exposed to a temperature of at least 135° C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, as fillers, thermal interface materials, and thermal management materials, for example, in electronic devices, more particularly mobile handheld electronic devices, power supplies, and batteries.

Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 20 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.

Abstract: Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a polyamide composition, (3) a multifunctional amine compound, and (4) a multifunctional (meth)acrylate compound and (b) an optional inorganic filler. The curable composition can result in the formation of cured compositions with properties such as good tensile strength, good elongation at break, good overlap shear strength, good adhesion to substrates such as metal substrates, or a combination thereof.

Abstract: A thermally conductive dielectric film includes a thermoplastic layer including polyester segments and 5 to 30% by wt polyether amide segments. The thermally conductive dielectric film has a thickness of less than 100 micrometers.