Patents by Inventor Mario Renzullo
Mario Renzullo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11991935Abstract: Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 ?A/?m2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.Type: GrantFiled: November 21, 2022Date of Patent: May 21, 2024Assignee: SeeQC, Inc.Inventors: Daniel Yohannes, Mario Renzullo, John Vivalda, Alexander Kirichenko
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Publication number: 20230380302Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.Type: ApplicationFiled: July 24, 2023Publication date: November 23, 2023Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
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Publication number: 20230337553Abstract: Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 ?A/?m2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.Type: ApplicationFiled: November 21, 2022Publication date: October 19, 2023Inventors: Daniel Yohannes, Mario Renzullo, John Vivalda, Alexander Kirichenko
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Patent number: 11711985Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.Type: GrantFiled: September 13, 2021Date of Patent: July 25, 2023Assignee: SeeQC IncInventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaevskii, Igor Vernik, John Vivalda, Jason Walter
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Publication number: 20220393089Abstract: Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 ?A/?m2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.Type: ApplicationFiled: June 2, 2021Publication date: December 8, 2022Inventors: Daniel Yohannes, Mario Renzullo, John Vivalda, Alexander Kirichenko
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Patent number: 11508896Abstract: Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 ?A/?m2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.Type: GrantFiled: June 2, 2021Date of Patent: November 22, 2022Assignee: Seeqc, inc.Inventors: Daniel Yohannes, Mario Renzullo, John Vivalda, Alexander Kirichenko
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Publication number: 20210408355Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.Type: ApplicationFiled: September 13, 2021Publication date: December 30, 2021Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
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Patent number: 11121302Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.Type: GrantFiled: October 11, 2019Date of Patent: September 14, 2021Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
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Publication number: 20200119251Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.Type: ApplicationFiled: October 11, 2019Publication date: April 16, 2020Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter