Abstract: A flame-retardant polyamide molding compound may have low phosphorus content. Such a polyamide molding compound may include (A) a polyamide matrix including polyamide(s) having at least 8 carbon atoms per amide unit; (B) a flame retardant composition comprising (B1) metal-free aryl phosphate(s), (B2) aryl phosphonate(s), (B3) carbohydrate polyol(s), (B4) melamine cyanurate(s), and (B5) optionally, non-phosphorus-comprising flame retardant(s). A total phosphorus content from the flame retardant composition may be in a range of from 0.5 to 1.5 wt.

Abstract: The present invention relates to a moulding compound which contains at least 50 wt. % of a semicrystalline poly amide component and the moulding compound contains a filler which imparts conductivity to the moulding compound, wherein the moulding compound does not have a crystallite melting point (Tm) below 50° C. and the polyamide component contains components A and B, A) PA homopolymer of the type PA X.Y or PAZ, where X is a diamine radical (DA), Y is a dicarboxyl radical (DC), and Z is an alpha-omega amino acid radical; B) PA copolymer of the type PA X?.Y?, where X is a diamine radical (DA?) and Y? is a dicarboxyl radical (DC?); wherein a portion of the diamine radical (DA?) is replaced by a polyether having at least two amino termini or at least two hydroxy termini; wherein the proportion of polyether in the sum of components A and Bis between 0.5 and 15 wt. % and wherein the proportion of filler is 2.5 to 6 wt. % based on the total mass of the poly amide component and the filler.

Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of fluoropolymer, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.

Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a molding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a molding compound containing at least 60 wt. % of thermoplastic polyester, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.

Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a molding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; II. a second layer (layer II) of a molding compound containing at least 60 wt. % of EVOH; III. a third layer of a polyamide molding compound, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.

Abstract: A multilayer hollow body has the following layers: I. an inner layer (layer I) containing a moulding composition based on PA612, PA610, PA1010, PA1012 and/or PA1212 and copolymers thereof and mixtures thereof; II. optionally an adhesion promoter layer (layer II) containing a moulding composition based on the following components: a) 0 to 80 parts by weight of a polyamide selected from PA6, PA66, PA6/66 and mixtures thereof, b) 0 to 100 parts by weight of a polyamine-polyamide copolymer and c) 0 to 80 parts by weight of a polyamide selected from PA11, PA12, PA612, PA1010, PA1012, PA1212 and mixtures thereof, where the sum total of the parts by weight of components a), b) and c) is 100; III. a layer (layer III) containing an ethylene-vinyl alcohol copolymer moulding composition is executed in such a way that not more than 0.2 g/m2 of insoluble extract and not more than 7.

Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of EVOH; III. a third layer of a polyamide moulding compound, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.

Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of fluoropolymer, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.

Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of thermoplastic polyester, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.