Patents by Inventor Mario RESING

Mario RESING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240309179
    Abstract: A flame-retardant polyamide molding compound may have low phosphorus content. Such a polyamide molding compound may include (A) a polyamide matrix including polyamide(s) having at least 8 carbon atoms per amide unit; (B) a flame retardant composition comprising (B1) metal-free aryl phosphate(s), (B2) aryl phosphonate(s), (B3) carbohydrate polyol(s), (B4) melamine cyanurate(s), and (B5) optionally, non-phosphorus-comprising flame retardant(s). A total phosphorus content from the flame retardant composition may be in a range of from 0.5 to 1.5 wt.
    Type: Application
    Filed: June 23, 2022
    Publication date: September 19, 2024
    Applicant: Evonik Operations GmbH
    Inventors: Alexey MERKULOV, Mario RESING, Juergen FRANOSCH, Eckart RUBAN, Andreas SZENTIVANYI, Duy Vu PHAM
  • Publication number: 20180080586
    Abstract: A multilayer hollow body has the following layers: I. an inner layer (layer I) containing a moulding composition based on PA612, PA610, PA1010, PA1012 and/or PA1212 and copolymers thereof and mixtures thereof; II. optionally an adhesion promoter layer (layer II) containing a moulding composition based on the following components: a) 0 to 80 parts by weight of a polyamide selected from PA6, PA66, PA6/66 and mixtures thereof, b) 0 to 100 parts by weight of a polyamine-polyamide copolymer and c) 0 to 80 parts by weight of a polyamide selected from PA11, PA12, PA612, PA1010, PA1012, PA1212 and mixtures thereof, where the sum total of the parts by weight of components a), b) and c) is 100; III. a layer (layer III) containing an ethylene-vinyl alcohol copolymer moulding composition is executed in such a way that not more than 0.2 g/m2 of insoluble extract and not more than 7.
    Type: Application
    Filed: September 19, 2017
    Publication date: March 22, 2018
    Applicant: Evonik Degussa GmbH
    Inventors: Jasmin BERGER, Karl KUHMANN, Mario RESING, Jan HEIMINK, Olivier FARGES, Stefan ALTKEMPER
  • Publication number: 20160271913
    Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of EVOH; III. a third layer of a polyamide moulding compound, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.
    Type: Application
    Filed: March 17, 2016
    Publication date: September 22, 2016
    Applicant: Evonik Degussa GmbH
    Inventors: Jasmin BERGER, Rainer GOERING, Klaus GAHLMANN, Michael BOEER, Mario RESING
  • Publication number: 20160271918
    Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of fluoropolymer, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.
    Type: Application
    Filed: March 17, 2016
    Publication date: September 22, 2016
    Applicant: Evonik Degussa GmbH
    Inventors: Jasmin BERGER, Rainer GOERING, Klaus GAHLMANN, Michael BOEER, Mario RESING
  • Publication number: 20160271921
    Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of thermoplastic polyester, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.
    Type: Application
    Filed: March 17, 2016
    Publication date: September 22, 2016
    Applicant: Evonik Degussa GmbH
    Inventors: Jasmin BERGER, Rainer GOERING, Klaus GAHLMANN, Michael BOEER, Mario RESING