Patents by Inventor Mario Siracusa

Mario Siracusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single substrate microwave radar transceiver including flip-chip integrated circuits
    Patent number: 5115245
    Abstract: A microwave radar transceiver assembly (30) includes a monolithic microwave integrated circuit (MMIC) chip (58) having a coplanar waveguide transmssion lines (100, 102, 104) formed on the same surface (58a) as the electronic elements thereof. Coplanar waveguide transmission lines (68, 70, 72) are also formed on a surface (62a) of a substrate (62). The transceiver chip (58), in addition to other chips (56, 60), are mounted on the substrate (62) in a flip-chip arrangement, with the respective surfaces (58a, 62a) on which the transmission lines (100, 102, 104; 68, 70, 72) are formed facing each other.
    Type: Grant
    Filed: September 4, 1990
    Date of Patent: May 19, 1992
    Assignees: Hughes Aircraft Company, Delco Electronics Corporation
    Inventors: Cheng P. Wen, Gregory S. Mendolia, Mario Siracusa, Joseph J. Maieron, William D. Higdon, John J. Wooldridge, Jon Gulick
  • Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide resonant inductor
    Patent number: 5087896
    Abstract: A coplanar waveguide based microwave monolithic integrated circuit (MMIC) oscillator chip (14) having an active oscillator element (16) and a resonant capacitor (18) formed thereon is flip-chip mounted on a dielectric substrate (12). A resonant inductor (22) is formed on the substrate (12) and interconnected with the resonant capacitor (18) to form a high Q-factor resonant circuit for the oscillator (10). The resonant inductor (22) includes a shorted coplanar waveguide section (24) consisting of first and second ground strips (24b,24c), and a conductor strip (24a) extending between the first and second ground strips (24b,24c) in parallel relation thereto and being separated therefrom by first and second spaces (26a,26b) respectively. A shorting strip (24d) electrically interconnects adjacent ends of the conductor strip (24a) and first and second ground strips (24b,24c) respectively.
    Type: Grant
    Filed: January 16, 1991
    Date of Patent: February 11, 1992
    Assignees: Hughes Aircraft Company, Delco Electronics Corporation
    Inventors: Cheng P. Wen, Gregory S. Mendolia, Mario Siracusa, Joseph J. Maieron, William D. Higdon
  • Active millimeter-wave integrated circuit
    Patent number: 3986153
    Abstract: An active millimeter wave integrated circuit including a thin non-metallic waveguiding layer mounted on an image plane and having an opening therein which exposes a given area of the image plane. An active solid state device, such as a millimeter wave diode, is mounted on the exposed area of the image plane, and millimeter wave energy is coupled to and from the device into the waveguiding layer by way of both a metallic ribbon (or wire) bonded to the active device and a connecting metallization pattern atop the waveguiding layer. This metallization pattern may assume various geometries corresponding to functional components such as low-pass filters, resonators, stepped or tapered metallized transitions, and the like, and also provides the desired impedance matching and efficient energy coupling between the active device and the waveguiding layer.
    Type: Grant
    Filed: November 17, 1975
    Date of Patent: October 12, 1976
    Assignee: Hughes Aircraft Company
    Inventors: Hiromu John Kuno, Yu-Wen Chang, Mario Siracusa