Patents by Inventor Marion C. Hunter

Marion C. Hunter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7390377
    Abstract: We demonstrate a new method for joining patterned thermoplastic parts into layered structures. The method takes advantage of case-II permeant diffusion to generate dimensionally controlled, activated bonding layers at the surfaces being joined. It is capable of producing bonds characterized by cohesive failure while preserving the fidelity of patterned features in the bonding surfaces. This approach is uniquely suited to production of microfluidic multilayer structures, as it allows the bond-forming interface between plastic parts to be precisely manipulated at micrometer length scales. The bond enhancing procedure is easily integrated in standard process flows and requires no specialized equipment.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: June 24, 2008
    Assignee: Sandia Corporation
    Inventors: Thomas I. Wallow, Marion C. Hunter, Karen Lee Krafcik, Alfredo M. Morales, Blake A. Simmons, Linda A. Domeier