Patents by Inventor Marion M. White

Marion M. White has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nanomaterial assisted bonding method to produce curved surfaces
    Patent number: 10486405
    Abstract: A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: November 26, 2019
    Assignee: U.S. Department of Energy
    Inventors: Kamleshkumar Suthar, Marion M. White
  • NANOMATERIAL ASSISTED BONDING METHOD TO PRODUCE CURVED SURFACES
    Publication number: 20190217592
    Abstract: A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.
    Type: Application
    Filed: January 16, 2018
    Publication date: July 18, 2019
    Inventors: Kamleshkumar Suthar, Marion M. White