Abstract: A radiation curable inkjet ink comprising a polymerizable compound, a phenolic resin and a thermal cross-linking agent, characterized in that the phenolic resin includes at least one structural moiety according to Formula I, Formula I wherein L represents a divalent linking group having no more than 10 carbon atoms; n represents 0 or 1; R1 and R2 independently from each other represent a group selected from the group consisting of a hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted alkaryl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted (hetero)aryl group and a substituted or unsubstituted alkoxy group.

Abstract: A radiation curable composition comprising at least one polymerizable compound and an adhesion promoter, characterized in that the adhesion promoter includes: —a polymerizable group selected from the group consisting of an acrylate, a methacrylate, an acrylamide, a methacrylamide, a styrene, a maleimide, a vinyl ether and a vinyl ester; and—an adhesion promoting group containing at least one nitrogen containing five or six membered heteroaromatic ring.

Abstract: A radiation curable inkjet ink comprising a polymerizable compound, a photoinitiator characterized in that the inkjet ink further comprises a di- or multifunctional alkoxysilane and a monofunctional alkoxysilane functionalized with a group selected from the group consisting of an epoxide and an oxetane.

Abstract: A method of manufacturing a Printed Circuit Board (PCB) including an inkjet printing step wherein a radiation curable inkjet ink comprising at least one polymerizable compound and at least one photoinitiator is jetted and cured on a substrate, characterized in that the at least one photoinitiator has a chemical structure according to Formula I, wherein X represents a halogen; R1 is selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted and unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted alkyl group and a substituted or unsubstituted aryl or heteroaryl group; R2 and R3 are independently from each other selected from the group consisting of a hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstitited alkoxy group, a substituted or unsubstituted aryloxy group and a halogen; R1 together with R2 and R2 together with R3 may represent the neces

Abstract: The radiation curable inkjet ink comprises a polymerizable compound and at least one thioether functionalized adhesion promoter, at least one alkoxysilane adhesion promoter and at least one acid funtionalized adhesion promoter.

Abstract: The invention provides an inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board. By using a solder mask inkjet ink containing at least one photoinitiator, at least one free radical polymerizable compound and at least one mercapto functionalized carboxylic acid as adhesion promoter, a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties, may be produced.

Abstract: A radiation curable inkjet ink comprising a polymerizable compound, a photoinitiator and a co-initiator, wherein the co-initiator is an aliphatic tertiary amine co-initiator or an aromatic co-initiator, the aromatic co-initiator selected from the group consisting of an amino substituted benzoic acid derivative, an amino substituted aromatic aldehyde and an amino substituted aromatic ketone, characterized in that the co-initiator comprises at least one functional group selected from the group consisting of an aliphatic thioether and an aliphatic disulfide.

Abstract: A radiation curable inkjet ink comprising a polymerizable compound and a photoinitiator, characterized in that the photoinitiator comprises a functional group selected from the group consisting of an aliphatic thio-ether and an aliphatic or a (hetero)aromatic disulfide.

Abstract: A radiation curable inkjet ink comprising a polymerizable compound and an adhesion promoter characterized in that the adhesion promoter has a chemical structure according to Formula I, wherein R1 is selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted alkaryl group, a substituted or unsubstituted aralkyl group and a substituted or unsubstituted aryl or heteroaryl group, R2 and R3 are independently selected from the group consisting of a hydrogen and a substituted or unsubstituted alkyl group, L represents an n+m+o valent linking group, n represents an integer ranging from 1 to 9, m represents an integer ranging from 1 to 9, o represents an integer ranging from 0 to 8, with the proviso that n+m+o is less than or equal to 10, X represents an oxygen or NR4, R4 is selected from the group consisting of a hydrogen, a substituted or unsubstituted alkyl group, a

Abstract: A photoinitiator selected from the group consisting of an acylphosphine oxide, a ?-hydroxy-ketone and a ?-amino-ketone, characterized in that the photoinitiator includes at least one aliphatic disulfide as functional group.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing a polymerizable adhesion promoter and a phenolic compound including at least two phenolic groups. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: The invention provides an inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board. By using a solder mask inkjet ink containing at least one photoinitiator, at least one free radical polymerizable compound and at least one mercapto functionalized carboxylic acid as adhesion promoter, a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties, may be produced.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one mercapto functionalized carboxylic acid as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one allyl sulfone compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one allyl sulfone compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing a polymerizable adhesion promoter and a phenolic compound including at least two phenolic groups. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one mercapto funtionalized carboxylic acid as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.