Patents by Inventor Marion Simon

Marion Simon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7842922
    Abstract: A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: November 30, 2010
    Assignee: Heimann Sensor GmbH
    Inventors: Wilhelm Leneke, Marion Simon, Mischa Schulze, Karlheinz Storck, Joerg Schieferdecker
  • Publication number: 20080216883
    Abstract: A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.
    Type: Application
    Filed: May 16, 2006
    Publication date: September 11, 2008
    Applicant: HEIMANN Sensor GmbH
    Inventors: Wilhelm Leneke, Marion Simon, Mischa Schulze, Karlheinz Storck, Joerg Schieferdecker
  • Patent number: 6710348
    Abstract: An apparatus for sensing electromagnetic radiation with local resolution for image-producing sensors that can be economically produced and installed is decribed. This is achieved, in that a micromechanically producible optical imaging system is provided.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: March 23, 2004
    Assignee: Robert Bosch GmbH
    Inventors: Manfred Rothley, Roland Mueller-Fiedler, Erich Zabler, Lars Erdmann, Wilhelm Leneke, Marion Simon, Karlheinz Storck, Joerg' Schieferdecker
  • Publication number: 20030118076
    Abstract: A sensor for measuring a temperature by means of a heat-sensitive area applied onto and/or underneath a membrane, the membrane being arranged above a recess. The recess is etched by a reactive ion etching method such that it is fully defined laterally by side walls arranged at an angle between 80° and 100° relative to the membrane, adjoining side walls being arranged at an angle of at least 40° relative to one another.
    Type: Application
    Filed: September 10, 2002
    Publication date: June 26, 2003
    Applicant: PerkinElmer Optoelectronics GmbH
    Inventors: Jorg Schieferdecker, Martin Hausner, Wilhelm Leneke, Marion Simon
  • Patent number: 6294787
    Abstract: Presented is a sensor system for the detection of thermal radiation, with a substrate (15) and several sensor elements (10) on the substrate (15), in which case at least one self-test device (53) is provided in order to generate heat which can be used for the heating of one or more sensor elements (10). The sensor elements (10) can be heated according to a typical time pattern during the self-testing process. Also presented is an advantageous process for the manufacture of the sensor system as well as an advantageous configuration of the total system, including signal processing.
    Type: Grant
    Filed: August 13, 1998
    Date of Patent: September 25, 2001
    Assignees: Heimann Optoelectronics GmbH, Robert Bosch GmbH
    Inventors: Jörg Schieferdecker, Marion Simon, Karlheinz Storck, Manfred Rothley, Erich Zabler, Rolf Jähne