Patents by Inventor Marites Laguipo Roque

Marites Laguipo Roque has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9048228
    Abstract: A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and the half-etched lead portion exposed from a lower perimeter side of the mold body.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: June 2, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Byung Tai Do, Emmanuel Espiritu, Allan P. Ilagan, Marites Laguipo Roque
  • Publication number: 20150084172
    Abstract: A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and the half-etched lead portion exposed from a lower perimeter side of the mold body.
    Type: Application
    Filed: September 26, 2013
    Publication date: March 26, 2015
    Inventors: Byung Tai Do, Emmanuel Espiritu, Allan P. Ilagan, Marites Laguipo Roque